Method for monitoring porefilling capability of copper electroplating solution

A technology of copper electroplating solution and electroplating solution, applied in the direction of electrolysis process, electrolysis components, material electrochemical variables, etc., to achieve the effect of improving productivity, promoting scientific research progress and reducing cost
CN101004402AInactive Publication Date: 2007-07-25ROCKWOOD ELECTROCHEM ASIA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ROCKWOOD ELECTROCHEM ASIA
Publication Date
2007-07-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for monitoring hole-filling ability of copper electroplating liquid includes utilizing copper rotary electrode to obtain the first relative potential value of electroplating preparation under the first rotating speed and obtain the second relative potential value of electroplating preparation under the second rotating speed, calculating out potential D-value between two obtained relative potential values and confirming that hole-filling ability is more stronger when potential D-value is more large.
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Description

technical field

[0001] The invention relates to a method for monitoring the hole filling ability of copper electroplating solution, in particular to a constant current measurement applicable to monitoring the change of hole filling ability of electroplating bath solution used for a long time and predicting the hole filling ability of electroplating solution Law. Background technique

[0002] Most of today's printed circuit boards use electroplating copper to make metal wires and fill the guide holes connecting the upper and lower layers. Various additives must be added to the electroplating copper plating solution to speed up the copper deposition rate at the bottom of the blind hole and reach the bottom of the hole. Bottom up filling phenomenon, so the analysis and control of the concentration of additives in the plating solution is an important topic in current research.

[0003] In the process of electroplating copper deposition in blind vias, different filling results w...

Claims

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