Method for estimating and monitoring dielectric film quality and reliability

A dielectric layer and reliability technology, applied in the field of reliability of microelectronic products, can solve the problem of not being able to quickly and clearly reflect the nature of dielectric layer process defects, and achieve the effect of simple application

Inactive Publication Date: 2007-08-15
信息产业部电子第五研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The TDDB model can evaluate the working life of the dielectric layer under low electric field and reflect some pr

Method used

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  • Method for estimating and monitoring dielectric film quality and reliability
  • Method for estimating and monitoring dielectric film quality and reliability
  • Method for estimating and monitoring dielectric film quality and reliability

Examples

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Embodiment Construction

[0020] The method for evaluating and monitoring the quality and reliability of the medium layer of the present invention comprises the following steps:

[0021] (1) First set the defect to cause the breakdown of the measured dielectric layer to be electric field breakdown;

[0022] (2) Applying an electric field to the measured dielectric layer causes the dielectric layer to break down to obtain a breakdown voltage V BD , breakdown voltage V BD Over 200V is regarded as 200V;

[0023] (3) Set the dielectric strength of the measured medium layer as E DS , dielectric strength E DS It is a fixed value under certain process conditions, and it is obtained by converting the maximum breakdown voltage or using the data of reference materials;

[0024] (4) Get the equivalent thickness d of the measured medium layer EQ equal to the breakdown voltage V BD and dielectric strength E DS ratio of

[0025] (5) The equivalent thickness d EQ Compared with the design thickness of the mea...

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Abstract

This invention discloses one method to estimate and monitor dielectric layer quality and reliability, which comprises the following steps: first setting deficiency to result the puncture of dielectric layer; exerting field onto tested dielectric layer to get puncture voltage of VBD; setting the tested dielectric intensity as EDS as certain value under process condition; getting tested dielectric thickness dEQ for comparison between puncture voltage with dielectric intensity; comparing the thickness with the tested dielectric layer production to get real dielectric thickness and design.

Description

technical field [0001] The invention relates to the reliability technology of microelectronic products, in particular to a method for evaluating and monitoring the quality and reliability of a dielectric layer. Background technique [0002] Dielectric layers are widely used in microelectronic products as thin gate oxide layers, capacitor dielectric layers, insulating layers and passivation layers between metal wirings, so the quality and reliability of dielectric layers in microelectronic products affect their yield and long-term reliability One of the most important issues of sex. [0003] With the rapid development of military and civilian communication systems, and the needs of weapon systems such as phased array radars, electronic countermeasures, and precision strike weapons, high-performance and high-reliability GaAs MMICs have achieved rapid development, making them a major component of microwave semiconductor devices. The development direction, and its reliability r...

Claims

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Application Information

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IPC IPC(8): G01N27/92G01R31/12G01B7/06
Inventor 黄云
Owner 信息产业部电子第五研究所
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