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Semiconductor device module with flip chip devices on a common lead frame

A flip-chip and lead frame technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as thermal effects on wafers

Inactive Publication Date: 2007-08-15
INTERNATIONAL RECTIFIER COEP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this approach may result in the operation of one wafer having a thermal effect on the other wafers stacked or layered on top of it compared to the flat lay approach

Method used

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  • Semiconductor device module with flip chip devices on a common lead frame
  • Semiconductor device module with flip chip devices on a common lead frame
  • Semiconductor device module with flip chip devices on a common lead frame

Examples

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Embodiment Construction

[0024] Figure 2 shows a circuit diagram of a step-down (buck) converter circuit, including MOSFET 15 in top-drain configuration, synchronous MOSFET 25 (synchronous MOSFET 25 is a DirectFET TM type), flip-chip type IC 94, which controls MOSFETs 15 and 25 in PWM mode to obtain a constant output DC voltage, and inductor 10 and capacitor 11. A step-down (Buck) converter circuit, also commonly known as a step-down converter, is typically used to step down a voltage. Therefore, the input voltage V IN greater than the output voltage V OUT . MOSFET die 15 , MOSFET die 25 , and IC die 94 are disposed in common package 21 . The die 15, 25, 94 is arranged in a planar manner in a lead frame 20 or other substrate that is both thermally and electrically conductive.

[0025] The thermal conductivity of the lead frame or other substrate can ensure efficient transfer of heat dissipated from the die 15, 25, 94 to one or more heat sinks (not shown) beneath the lead frame or other substrate. ...

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PUM

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Abstract

The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.

Description

[0001] related application [0002] This application claims priority to US Provisional Application No. 60 / 576,703, filed June 3, 2004, the contents of which are hereby incorporated by reference. technical field [0003] The invention relates to a module comprising at least a semiconductor part of a flip-chip device forming an electric circuit. Background technique [0004] Various types of electronic circuits such as DC-DC converters, synchronous converters, etc. require a large number of semiconductor components such as MOSFETs and ICs. These circuit elements are found in portable electronic devices and the support elements are usually individually packaged and mounted individually on the support board. Individually packaged components take up space on the board, and individual components generate heat. If the component is near other components, such as a microprocessor, the component may interfere with the operation of the microprocessor. [0005] In order to solve the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/44H01L23/02H01L23/34H01L23/48H01L23/538H01L25/16
CPCH01L2924/0002H01L2224/32225H01L24/33H01L2224/16225H01L2224/73253H01L2924/12032H01L2924/13091H01L2224/40137H01L2224/84801H01L2224/83801H01L2224/8385H01L2924/00014H01L2924/1306H01L23/5385H01L24/01H01L25/162H01L2924/14H01L24/40H01L2924/00H01L2224/37099H01L2224/37599
Inventor C·P·沙费尔C·谢K·胡
Owner INTERNATIONAL RECTIFIER COEP