Method for judging leakage current in integrated circuit and MOS element
A technology of oxide semiconductors and integrated circuits, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve few problems such as integrated circuits, and achieve the effect of shortening feedback time and precise calibration
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[0031] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings.
[0032] The object of the present invention and its implementation method are described in detail in the following preferred embodiments. However, the concept of the present invention can also be applied in other fields. The following examples are only used to illustrate the purpose and implementation method of the present invention, and are not intended to limit the scope thereof.
[0033] Conventionally, integrated circuits are subjected to wafer-level measurements after wafer fabrication, and the intensity of leakage current is measured during the wafer-level measurements. There is a long delay from the time a possible error handling step (culprit process step) is started to the time a feedback is obtained. Root cause analysis is thus delayed...
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