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Method for manufacturing a heat exchanger

A technology for heat exchangers and manufacturing methods, which are applied in the directions of heat exchanger fixing, heat exchange equipment, manufacturing tools, etc., can solve problems such as limited shape, and achieve the effects of reducing manufacturing costs and improving compressive strength.

Inactive Publication Date: 2007-10-03
XENESYS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Thus, it is difficult to apply the heat exchanger technology described in Japanese Patent Publication No. S54-18232 and Japanese Patent Provisional Publication No. 2003-262489 to other types of heat exchangers used as heat exchangers in these patent publications The shape of the plate of the main part is restricted
This technique cannot be applied without modification to the bonding of the plates of plate heat exchangers where all pressure-formed plates are arranged one on top of the other due to deformation problems such that adjacent plates The protrusions contact each other in the same manner as described in Japanese Patent Provisional Publication No. 2003-194490

Method used

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  • Method for manufacturing a heat exchanger
  • Method for manufacturing a heat exchanger
  • Method for manufacturing a heat exchanger

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no. 1 example

[0038] Next, a first embodiment of the present invention will be described in detail with reference to FIGS. 1-8. Fig. 1 is a plan view, represents the plate assembly manufactured according to the heat exchanger manufacturing method of the first embodiment of the present invention; Fig. The view of the lamination state of the heat exchange plates in the method; Fig. 3 is a view showing the placement state of the cover plate in the heat exchanger manufacturing method according to the first embodiment of the present invention; Fig. 4 is a view showing the heat exchange plate according to the first embodiment of the present invention A view of the state in which the cooling plate is placed in the exchanger manufacturing method; FIG. 5 is a view showing a state in which the cooling plate and the heat exchange plate are combined in the heat exchanger manufacturing method according to the first embodiment of the present invention; FIG. 6 is a view showing In the heat exchanger manuf...

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Abstract

Heat exchange plates (10) are stacked, with a pressing force applied to the plates (10) so as to maintain parallelism of them and prevent deformation of them during a diffusion bonding process. The stacking condition is maintained and adjacent plates (10) come into contact with each other at projections (13) and peripheral edges. Space surrounding the contact portions of the plates (10) is put in a vacuum or low pressure state in which only an inner gas atmosphere exists. The plates (10) are kept at a temperature at which the diffusion bonding occurs by a predetermined period of time to diffusion-bond portions of the plates (10), which are only brought into contact with each other and have not been bonded together.

Description

technical field [0001] The present invention relates to a method of manufacturing a heat exchanger in which a plurality of heat exchange plates each made of thin metal plates are combined parallel to each other and integrally, and more particularly to a method for manufacturing such a heat exchanger A method in which pressure-formed heat exchange plates are arranged one on top of the other and integrally bonded to each other at contact portions thereof to provide the heat exchanger with strength to withstand high pressure. Background technique [0002] If it is required to increase the heat transfer coefficient to improve the heat exchange effect, a heat exchanger is used through which heat transfer (ie, heat exchange) occurs between a high-temperature fluid and a low-temperature fluid, and plate heat exchangers are generally widely used. A plate heat exchanger has a structure in which a plurality of heat transfer plates are placed one on top of another at a prescribed inter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/00B23K20/14B23K11/02B23K11/36F28F3/08F28F3/04F28D9/00B23K101/14
CPCF28F2275/061F28F2235/00F28D9/0037F28F2240/00B23K20/023B23K2201/14B23K2101/14Y10T29/49366F28D9/00B23K20/00F28F3/08
Inventor 松崎豊明渡边太郎
Owner XENESYS