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Composition object of heat conducting polusiloxane, and electronic component combination of using the composition object

A technology of polysiloxane and electronic components, applied in heat exchange materials, cooling/ventilation/heating transformation, chemical instruments and methods, etc., can solve problems such as oil spills, and achieve the effect of improving reliability and stabilizing the use state

Inactive Publication Date: 2007-10-10
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this kind of thermal paste will cause oil spillage due to the heating of the base oil during long-term use, so it is difficult to directly apply it between the radiator and the heating electronic components

Method used

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  • Composition object of heat conducting polusiloxane, and electronic component combination of using the composition object
  • Composition object of heat conducting polusiloxane, and electronic component combination of using the composition object
  • Composition object of heat conducting polusiloxane, and electronic component combination of using the composition object

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Embodiment

[0021] The present invention will be described in more detail below in conjunction with the examples. It should be understood that the present invention should not be considered as limited to these examples.

[0022] Component A:

[0023] Hydroxyl-containing organopolysiloxane represented by the following molecular formula:

[0024]

[0025] Component B:

[0026] Aluminum powder with an average particle size of 2 μm.

[0027] Firstly, component A and component B were stirred and mixed evenly at room temperature according to the blending ratio shown in Table 1, to prepare the thermally conductive polysiloxane composition of the present invention. Next, according to the interface thermal resistance measurement standard ASTM D-5470, the thermally conductive polysiloxane composition was sandwiched between two standard copper blocks, and the interface thermal resistance was measured. At the same time, the thermally conductive polysiloxane composition was subjected to pressure...

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Abstract

This invention discloses a heat-conducting silicone composition used in electronic combined component. The heat-conducting silicone composition comprises: component A (organic silicone with hydroxyls), and component B (highly heat-conducting inorganic filler). The heat-conducting silicone composition has such advantages as high application stability and no oil overflow.

Description

【Technical field】 [0001] The invention relates to a heat-conducting polysiloxane composition used for heat dissipation of heat-generating electronic components and an electronic component combination using the composition. 【Background technique】 [0002] With the rapid development of the computer industry, more and more heat is released by the heat-generating electronic components. In order to make the heat-generating electronic components operate normally at an appropriate temperature, a heat sink is generally attached to the heat-generating electronic components. To assist heat-generating electronic components to dissipate heat and ensure stable operation of heating-electronic components. [0003] However, the surfaces of general heat sinks and heating electronic components are uneven, resulting in air gaps when the two are attached to each other, and the thermal conductivity of air is very low, generally about 0.025W / (m·℃), which seriously affects overall cooling effect....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14H05K7/20
CPCC09K5/14
Inventor 郑景太郑年添
Owner FU ZHUN PRECISION IND SHENZHEN
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