The invention discloses a high-reliability planar bump type packaging method and a packaging structure, and belongs to the field of semiconductor packaging. In the back protection process existing inthe prior art, a simple ink brushing process cannot ensure the effective glue gripping area of metal pins, the area of the pins is small after cutting, and the problem of poor probe contact effect issolved. The high-reliability planar bump type packaging method and the packaging structure are provided, the packaging structure includes a chip bearing base, a wire bonding inner lead bearing base, chips, lead wires and a plastic package body, the chip bearing base comprises base islands and front metal layers of the base islands, the wire bonding inner lead bearing base comprises pins and frontmetal layers of the pins, and an excess metal area, except the back face of a pin metal layer, is provided with an ink layer. A good glue gripping effect is achieved, the contact defect rate is low, the contact effect is good and the detection rate is high during the detection of finished products.