Chip package structure

Abstract

The chip package structure comprises: a base, including multiple first / second joint points arranged on the first / second side area of base; a first chip arranged on the base, which includes multiple first welding pads on the first wire bonding area near the first joint points to cross over the first joint points and pad by first wire; and a second chip set on but not the symmetrical center of the first chip, which includes multiple second welding pads on the second wire bonding area near the second joint points to cross over the second joint points and pad by second wire.

Description

technical field [0001] The present invention relates to a chip packaging structure, in particular to a chip stacked (stacked) packaging structure. Background technique [0002] In the semiconductor industry, the development of system-on-chip (SOC) packaging is affected by process yield and high cost, and cannot be mass-produced. It is replaced by a chip stack package structure with a higher yield rate, which can meet the specifications of a chip size package (CSP) to meet the needs of general small electronic devices. [0003] FIG. 1 is a schematic diagram of wire bonding of a conventional chip packaging structure. The chip packaging structure 100 includes a substrate 110 , a first chip 120 and a second chip 130 on the first chip 120 . The first bonding pad 122 on the first chip 120 of the lower layer is connected to the first contact 112 of the substrate 110 with a plurality of first wires 124, which belongs to the first level of wire bonding, while the second pad 130 on ...

AI Technical Summary

Problems solved by technology

[0004] It should be noted that since the distance between the second wire 134 and the second pad 132 and the second contact 114 is very long, and crosses over the first wire 124, once the second wire 134 and the first wire When the line distance between 124 is shortened or the molding flow (molding flow) hits the second wire 134 to cause sweeping (sweeping), the first and second wires 124 and 134 of different levels are prone to false contact and short circuit

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