Combined process for cleaning infectant on the surface of cardinal plate

A technology for substrate surface and pollutants, applied in cleaning methods and utensils, cleaning methods using gas flow, chemical instruments and methods, etc., can solve problems such as inability to effectively remove particles, and achieve the effect of reducing equipment costs and improving cleaning effects.

Active Publication Date: 2007-12-05
METAL INDS RES & DEV CENT
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  • Abstract
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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for cleaning the surface pollutants of the substrate in a composite manner, so as to solve the problems of waste of resources, energy consumption and environmental protection caused by the use of a large amount of water and chemical solvents in the prior art wet cleaning process , and also overcome the disadvantage that the prior art dry cleaning process can only be aimed at the removal of organic pollutants, but cannot effectively remove particles

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  • Combined process for cleaning infectant on the surface of cardinal plate
  • Combined process for cleaning infectant on the surface of cardinal plate

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Embodiment Construction

[0027] As shown in FIG. 1 , a method of the present invention for cleaning surface pollutants of a composite substrate, the method S1 of the composite cleaning substrate surface pollutants includes providing a substrate (step S10), providing a plasma supply unit ( Step S20 ), providing a carbon dioxide snowflake supply unit (step S30 ), performing plasma spraying operation on the substrate (step S40 ), and performing plasma and carbon dioxide snowflake spraying operation on the substrate (step S50 ).

[0028] With reference to Fig. 1 and Fig. 2, a kind of method of the present invention is with the method S1 of the surface contamination of composite cleaning substrate, the method S1 of the surface contamination of this composite cleaning substrate, firstly provide a substrate (step S10), substrate 10 surface There are pollutants, and the substrate 10 can be moved, that is, the substrate 10 is arranged on a moving mechanism (not shown in the figure) to reach the substrate to mov...

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Abstract

The composite process of eliminating surface pollutant from base plate includes the steps of: providing one base plate, providing one plasma supply unit, providing one CO2 flake supplying unit, performing plasma cleaning of the base plate, and performing plasma and CO2 flake cleaning of the base plate. The composite process can eliminate organic pollutants and particles from the surface of the base plate, and has low water consumption, low power consumption and no environmental pollution.

Description

technical field [0001] The invention relates to a method for cleaning the surface pollutants of a substrate with a composite method, in particular to a method for effectively removing the composite of various organic pollutants and particles without consuming a large amount of resources and energy, and without causing environmental problems. A method for cleaning substrates from surface contamination. Background technique [0002] At present, whether it is the semiconductor industry, the flat panel display (FPD) industry, the printed circuit board (PCB) industry, the flexible circuit board (FPCB) industry, etc., the cleaning methods of the products produced mainly use wet processes to remove grease, fingerprints, Organic pollutants such as residual solvents, and particulates such as metals or oxides. [0003] However, the existing wet cleaning process technology has the disadvantages of chemical emission regulations and increasing costs of pure water and solvents, and becau...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B7/04B08B5/04H05F3/00
Inventor 郭子祯杨胜仲
Owner METAL INDS RES & DEV CENT
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