Light emission microscope opposite side sample fixer

Abstract

The light transmitting microscope back sample fixture mainly comprises the sample bearing base plate, sample fixing pole and at least three movable threaded cushion, middle of the sample bearing plate embedded with transparent glass as the location for bearing sample. It does not need thermosol, without pollution, being material saving and convenient in use.

Description

technical field [0001] The invention relates to a light emission microanalysis technique, in particular to a design scheme of a sample holder of a light emission microscope. Background technique [0002] Optical Emission Microscopy (EMMI) is a new defect localization analysis technique with high sensitivity and high resolution developed in the 1990s. With the continuous decline of the line width of semiconductor devices, optical emission microscopy has been widely used in the location of failure points and failure mechanism analysis of leakage, breakdown, hot carriers and other failure points in integrated circuits and discrete devices. [0003] As a new type of high-resolution microscopic defect localization technology, light emission microscopy can quickly and accurately locate device failure defects in a wide range, so it is widely used in device failure analysis. [0004] In semiconductor devices with leakage, breakdown, and hot carrier effects, the failure point genera...

AI Technical Summary

Problems solved by technology

However, there are two main problems in the processing process: one is that there are air bubbles between the back of the chip and the glass due to the glue, which has a great negative impact on the backside capture during EMMI analysis; the other is that after the EMMI analysis is completed, the The process of removing the chip from the glass slide can easily contaminate the surface of the chip, because the hot melt is difficult to clean when the chip is removed, and it sticks to the surface of the chip, which makes it difficult for subsequent analysis. Usually, the failure analysis step after EMMI analysis requires a chip Deprocessing is used to remove chip structures such as protective layers, insulating layers, and metal layers. If the chip surface is contaminated, it will have a great negative impact on chip deprocessing.

[0007] Limited by the inherent sample preparation method, the above problems are difficult to avoid

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