SMT no-lead tinol

A lead-free solder paste and solder paste technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as incomprehension of welding performance, and achieve low corrosiveness, high insulation resistance, and wetting expansion. good effect

Inactive Publication Date: 2007-12-19
SHENZHEN UNIBRIGHT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problems of solder paste in the prior art that the color of the residue in soldering is relatively dark, and the soldering performance is not understood, and provide a SMT soldering paste with good soldering performance and light color of the residue after soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The invention provides a solder paste for surface mount technology lead-free solder paste, wherein the solder paste includes a solvent, a thixotropic agent, an adhesive, an active agent, a surfactant and an antioxidant, and the active agent is composed of methyl The composite activator formed by succinic acid, organic acid, and halogen salts, the following are examples and comparative examples of the solder paste formulations of the present invention. See Table 1:

[0014] name

comparative example

Example

example 1

Example 2

Example 3

example 1

Example 2

Example 3

fully hydrogenated rosin

25

30

20

25

30

20

Esterified Rosin

20

25

20

25

dimerized rosin

20

20

Diethylene glycol monoethyl ether

12

15

12

15

[...

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PUM

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Abstract

The SMT no-lead tinol includes solvent, thixotropic agent, adhesive, composite activating agent, surfactant and antioxidant, and the composite activating agent consists of methyl succinic acid, organic acid and halogen salt. The SMT no-lead tinol has the features of high wettability, good printing performance, homogeneous and fine paste, light color of the soldered residue, low corrosion and high storage stability, and is suitable for use in twice reflux soldering of double-sided circuit board in electronic industry.

Description

technical field [0001] The invention relates to a solder paste for surface mounting (SMT) lead-free solder paste. Background technique [0002] The lead-free solder paste used in the assembly process of traditional electronic products is mainly composed of tin alloy powder and solder paste. The tin powder alloy is mainly an alloy composed of 63% tin and 37% lead, and its melting point is 183°C , but the European Union announced the ROHS Directive, stipulating that from July 1, 2006, electronic and electrical products containing six hazardous substances of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers exceeding the specified limit levels are prohibited Entering the EU market, and China's ROHS will be officially implemented on March 1, 2007, so electronic companies must use new materials and new technologies to meet the market's green environmental protection and lead-free requirements. With the research of lead-free ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26
Inventor 王琏郭艳萍
Owner SHENZHEN UNIBRIGHT TECH
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