Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Technique of integrate circuit, and data analysis method of semiconductor technique

A data analysis and integrated circuit technology, applied in the fields of electrical digital data processing, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as time-consuming, manpower, correlation is not far away, and process yield is not necessarily achieved. Improve product yield, reduce workload and save manpower

Active Publication Date: 2007-12-26
UNITED MICROELECTRONICS CORP
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the past, when the yield of the process was low, it was easy to identify the problem that actually caused the yield drop
However, with the improvement of the process, when the yield rate increases to a certain level (such as above 80%), the correlation between the results of various tests and the yield rate is not far away, and too much noise will be generated at the same time, so Increased possibility of misjudgment
As a result, it becomes very difficult to determine which is the major killer of yield and which is the minor killer
Not only does it take a lot of time and manpower to analyze, but it may not necessarily improve the yield of the process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Technique of integrate circuit, and data analysis method of semiconductor technique
  • Technique of integrate circuit, and data analysis method of semiconductor technique
  • Technique of integrate circuit, and data analysis method of semiconductor technique

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] FIG. 1 is a flowchart illustrating the steps of a data analysis method for an integrated circuit process according to an embodiment of the present invention.

[0035] Please refer to FIG. 1 first. The present invention proposes a data analysis method for integrated circuit technology, which is suitable for analyzing multiple products. The integrated circuit technology refers to, for example, semiconductor technology, packaging technology, technology of optoelectronic components (such as light-emitting diodes, liquid crystal display panels, plasma display panels) and the like. The products of the so-called integrated circuit process are, for example, multiple wafers on multiple batches of wafers in the semiconductor process, multiple chip finished products in the packaging process, multiple pixels in multiple batches of display panels in the photoelectric element process, and so on.

[0036] In order to ensure the product yield and the normal operation of each machine, t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for analyzing data of integrated circuit process and semiconductor process includes dividing products to be a normal group and an abnormal group according to result of on-line quality test, dividing said products to be a qualified group and a unqualified group according to result of yield test, defining mixture of unqualified group and normal group to be the first question group and mixture of unqualified group and abnormal group to be the second question group then analyzing two said question groups for identifying out main factor causing unqualification so as to raise product yield.

Description

technical field [0001] The invention relates to an analysis method of test data, in particular to a data analysis method for analyzing test results in an integrated circuit process or a semiconductor process. Background technique [0002] With the rapid development in IC related industries, the market for electronic components has been continuously expanding. Among them, the products of semiconductor technology, packaging technology, optoelectronic industry (such as light-emitting diodes, liquid crystal displays, plasma display panels) and other such technologies are formed through tedious procedures such as multiple steps. The common point is that the product is a Whole batches are produced in batches, and various quality inspections will be carried out to maintain the yield rate of the products. [0003] Generally speaking, in order to immediately repair the defects in the process or correct the related problem machines, the in-line quality test (In-line QC Test) will be ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/00G01R31/00G01R31/28H01L21/66H01L21/00
Inventor 张国海李启明杜路营郭瑞俊
Owner UNITED MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products