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Method for preparing electronic equipment

An electronic device and manufacturing method technology, which is applied in the field of card-type electronic device manufacturing method, can solve the problems of increasing the production cost of the cover body, increasing the difficulty of mass production, and difficult folding movements, so as to avoid assembly deviation and increase production capacity , Improve the effect of assembly error

Inactive Publication Date: 2007-12-26
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, although the above-mentioned method can make the originally separated two lids folded through the lugs 24 to realize group setting and positioning, when mass production is carried out on the production line, the folding action is difficult to be completed in an automated manner, thus increasing the cost of mass production. Difficulty, especially when performing ultrasonic welding, if the two covers are not folded to a certain position, partial welding will occur, and it will also increase the production cost of the cover

Method used

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  • Method for preparing electronic equipment
  • Method for preparing electronic equipment
  • Method for preparing electronic equipment

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Embodiment

[0022] FIG. 3 is a schematic flow chart of the manufacturing process of the electronic device of the present invention, and FIGS. 4A to 4G are partial schematic views of each process.

[0023] As shown in FIG. 3 and FIG. 4A, a plurality of semiconductor packages 30 and a casing for encapsulating the semiconductor packages 30 are provided, the casing includes an upper cover 310 and a lower cover 311, and each of the plurality of The lower cover 311, the semiconductor package 30 and the upper cover 310 are classified and arranged in the loading action zone Z1. The loading action zone Z1 is provided with a first assembly station S1, a second assembly station S2, and a third assembly station S3. The lower cover 311 , the semiconductor package 30 and the upper cover 310 . The upper cover 310 and the lower cover 311 are injection-molded plastic parts.

[0024] As shown in Fig. 3, Fig. 4B and Fig. 4C, a carrying jig 4 is provided in addition, and this carrying jig 4 is provided with...

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Abstract

A method for preparing electronic device includes setting multiple bottom cover body and semiconductor packaged element as well as top cover body on assembling-operation region, providing carry-fixture with multiple positioning unit, placing multiple bottom cover body on said multiple positioning unit, setting semiconductor packaged element and top cover body on bottom cover body, sending carry-fixture with bottom and top cover bodies as well as semiconductor packaged element to combination operation region then combining two said cover bodies on carry-fixture to form electronic device with semiconductor packaged element.

Description

technical field [0001] The invention relates to a method for manufacturing an electronic device, in particular to a method for manufacturing a card type electronic device. Background technique [0002] Ultrasonic welding is an environmentally friendly and safe welding method. It uses contact friction to generate heat to melt and combine plastics. At present, the casings of many electronic devices are combined using this welding method. [0003] Fig. 1 is a traditional secure digital memory card 1 (Secure Digital memory card, referred to as SD card), which includes: a semiconductor package 11 and relative covers 101, 102 covering the semiconductor package 11, ultrasonic welding is carried out after the assembly is completed , made into SD memory card 1. [0004] The above-mentioned assembly method was carried out manually in the early days. However, through manual assembly, deviations are often caused by human negligence, which often affects the quality rate of finished prod...

Claims

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Application Information

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IPC IPC(8): G06K19/077H01L21/52
Inventor 陈建志王忠宝顾永川
Owner SILICONWARE PRECISION IND CO LTD