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COF flexible printed wiring board and manufacturing method for the same

A technology of flexible printing and manufacturing method, which is applied in the directions of printed circuit components, secondary processing of printed circuits, and assembling printed circuits with electrical components, which can solve the problems of poor reliability and productivity, deformation of carrier tapes, sticking of insulating layers, etc. problems, to improve reliability and productivity, and to avoid fusion bonding

Inactive Publication Date: 2008-01-09
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the installation process, due to heating, the insulation layer is heated to a relatively high temperature, and a part of the insulation layer will be melted and stuck to the heating tool, which will cause the production device to stop running
In addition, undesired deformations of the carrier tape occur
In the case where the insulating layer is melted and bonded to the heating tool, the heating tool is contaminated, thus degrading reliability and productivity

Method used

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  • COF flexible printed wiring board and manufacturing method for the same
  • COF flexible printed wiring board and manufacturing method for the same
  • COF flexible printed wiring board and manufacturing method for the same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0096] Examples 1a-1d

[0097] Various commercially available polyimide film substrates, namely S'PERFLEX (trade name: product of Sumitomo Metallurgy Co., Ltd., Example 1a), ESPANEX (trade name: product of Nippon Steel Chemical Co., Ltd., Example 1b ), NEOFLEX (trade name: product of Mitsui Chemicals, Inc., Example 1c), and UPISEL (trade name: product of Ube Industries, Ltd., Example 1d) provided laminated films for producing COFs. The conductor layer of each laminated film is patterned using photoresist. The resulting entire pattern was tin-plated, and a silicone series resin (containing a silane compound) SR2411 (trade name: product of Dow Corning Toray Silicone Co., Ltd.) was coated on the back side of this film substrate. This coating was heated at 125°C for 1 hour to form a COF film carrier tape with a release layer.

example 2

[0098] Examples 2a-2d

[0099] Various commercially available polyimide film substrates similar to those used in Examples 1a-1d, namely S'PERFLEX (trade name: product of Sumitomo Metallurgical Co., Ltd., Example 2a), ESPANEX (trade name: product of Nippon Steel Chemical Co., Ltd., example 2b), NEOFLEX (trade name: product of Mitsui Chemicals Co., Ltd., example 2c) and UPISEL (trade name: product of Ube Industries, Ltd., example 2d) were used Provide laminated films for COF fabrication. The conductor layer of each laminated film is patterned using photoresist. The resulting entire pattern was tin-plated, and polysiloxane series resin (containing a silazane compound) SEPA-COAT (trade name: product of Shin-Etsu Chemical Co., Ltd.) was coated on the back side of this film base. This coating was heated at 125°C for 1 hour to form a COF film carrier tape with a release layer.

example 3

[0107] Examples 3a-3d

[0108] Various commercial polyimide films similar to those used in Examples 1a-1d, i.e. S'PERFLEX (trade name: product of Sumitomo Metallurgy Co., Ltd., Example 3a), ESPANEX (trade name: Nippon Steel Chemical Co., Ltd. product, embodiment 3b), NEOFLEX (trade name: product of Mitsui Chemicals Co., Ltd., embodiment 3c) and UPISEL (trade name: product of Ube Industry Co., Ltd., embodiment 3d) are used to provide laminates for the manufacture of COF layer film. The conductor layer of each laminated film was patterned using a photoresist method. The resulting entire pattern was tin-plated, and silicone series oil SRX310 (trade name: product of Dow Corning Toray Silicone Co., Ltd.) was coated on the back side of this film substrate. This coating was heated at 125°C for 1 hour to form a COF film carrier tape with a release layer.

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Abstract

Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line.

Description

[0001] This patent application is a divisional application with title of invention: COF flexible printed circuit board and method for manufacturing the circuit board, filing date: March 13, 2003, and application number: 03119617.9. technical field [0002] The present invention relates to COF (chip-on-film) flexible printed circuit boards, such as COF type film carrier tapes or COF type flexible printing for mounting electronic devices such as integrated circuits (IC) and large scale integrated circuits (LSI) thereon circuit (FPC). The invention also relates to a method for manufacturing the COF flexible printed circuit board. The term "COF flexible printed wiring board" refers to a flexible printed wiring board on which electronic devices (chips) are to be mounted. The term "COF film carrier tape" refers to a tape-shaped film substrate on which electronic components (chips) are to be mounted. Background technique [0003] The development of the electronics industry has be...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01L23/498H01L21/60H05K3/28H05K3/34
CPCH01L24/81H01L2224/16225H01L2924/14
Inventor 坂田贤林克彦
Owner MITSUI MINING & SMELTING CO LTD