Lithographic apparatus, aberration correction device and device manufacturing method
A technology of aberration correction and lithography equipment, which is applied in the direction of microlithography exposure equipment, photomechanical equipment, photolithography exposure equipment, etc., and can solve problems such as deformation and component heating
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[0043] Fig. 1 schematically shows a lithographic apparatus according to an embodiment of the present invention. The equipment includes:
[0044] An illumination system (illuminator) IL configured for conditioning a radiation beam B (eg UV radiation or DUV radiation).
[0045] a support structure (e.g. mask table) MT constructed to support a patterning device (e.g. mask) MA and connected to a first positioner PM configured for patterning according to determined parameters The device is accurately positioned;
[0046] A substrate table (e.g., a wafer table) WT is configured to hold a substrate (e.g., a resist-coated wafer) W and is connected to a second positioner PW configured for for precisely positioning said substrate according to determined parameters; and
[0047] A projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to said radiation beam B onto a target portion of said substrate W (e.g. comprising one or more tubes ...
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