Instrument for accurate cutting of crystal round examples and method of use thereof

Abstract

Aiming at simply and reliably implementing the precise cutting to the wafer sample testing belt, the invention relates to a cutting tool cutting the wafer sample testing belt and the application method. The cutting tool includes a device frame, a magnifier, a sample table, a cutter rest and a cutter; wherein, the cutter is arranged in the cutter rest, the magnifier and the frame of the magnifier are arranged on the cutter rest, and the sample table is also arranged on the cutter rest.

Description

technical field [0001] The invention relates to a wafer sample cutting tool used in semiconductor production and a using method thereof, in particular to a wafer sample test strip cutting tool and a using method thereof. Background technique [0002] At present, in semiconductor production, there are often microstructure images for testing on the wafer dicing lanes to form test strips. When doing failure analysis, it is often necessary to observe the micro-pattern structure located below the test strip, so it is necessary to cut the test strip structure with a width of about 40-60 microns when cutting the wafer sample. [0003] However, there are problems in the two cutting methods commonly used in the current cutting method. [0004] One way to cut is to use visual inspection to locate and then cut the test strip in half by hand using a diamond-tipped cutting pen. In this way, the operator cannot well grasp the magnitude of the force and the depth of the cut, and the nake...

AI Technical Summary

Problems solved by technology

This type of machine is expensive, and the operation procedures are complicated. In addition, the cutting of these machines also has strict requirements on the sample. Not only is the operation complicated, the cutting cost is high, and it is time-consuming

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