7results about How to "For accurate cutting" patented technology

The invention discloses a high-precision electronic chip processing and positioning device and a using method thereof, and relates to the technical field of electronic chip processing and positioning, the high-precision electronic chip processing and positioning device comprises a first plate body, a rod body and a rotating plate, a control unit is installed at the top of the first plate body, the rod body is installed at the top of the first plate body, and first hydraulic telescopic units are symmetrically installed on one side of the rod body; and the first hydraulic telescopic unit is in electric signal connection with the control unit, a moving frame is installed at the output end of the first hydraulic telescopic unit, a rotary supporting mechanism is arranged in the moving frame, and a laser ranging unit is installed on one side of the rod body and is in electric signal connection with the control unit. The wafer is placed on the rotating plate, and then the moving distance of the wafer can be measured through the laser ranging unit, so that the machining positioning device can be conveniently placed below a cutter cutting device for equal-interval accurate cutting.

The utility model relates to the technical field of garment processing, and discloses a garment pattern making machine which comprises a machine frame and a pattern making machine body erected on the machine frame, four material pressing mechanisms are arranged on the machine frame, and the four material pressing mechanisms are symmetrically distributed on the two sides of the top of the machine frame; the rack is further provided with a positioning mechanism for rapidly positioning cloth, the positioning mechanism comprises two graduated scale strips embedded in the top of the rack and two mounting plates capable of moving relatively, the two graduated scale strips are symmetrically distributed on the two sides of the two mounting plates, and the two mounting plates are symmetrically distributed; according to the utility model, through the arrangement of the positioning mechanism, the positioning and calibration of the clothing cloth can be realized, so that the clothing cloth can be conveniently and accurately cut, the clothing cloth is prevented from being in an inclined state when being flatly laid on the rack, and the problems that defective products are generated and the cloth is wasted due to the fact that the cloth is easy to deviate during cutting are solved; the subsequent processing of the cloth is facilitated.

The utility model relates to wood -plastic board cutting machine technical field, concretely relates to a cutting machine for ecological wood -plastic board production, including wood platform saw body, positioning structure and fine adjustment structure, the wood platform saw body includes work table, the top rear end fixed connection of work table two threaded rods no.

The utility model relates to the technical field of rodent nose tissue pathological specimen material taking, specifically discloses rodent nasal mucosa tissue material taking device, the one side of fixed plate is provided with first fixed clamping groove and second fixed clamping groove respectively, is provided with head container on the fixed plate, is provided with first clamping groove insertion port, second clamping groove insertion port and cutting knife clamping groove on head container respectively, and the one side of head container is provided with scale, the rodent nasal mucosa tissue material taking device whole simple structure, and the installation and use are convenient, and the material taking work of rodent nasal mucosa tissue of staff is convenient, since setting up the scale for measuring distance on the bottom plate, a plurality of graduation grooves are opened on the scale, the position of rodent head tissue is measured through the scale, is convenient for its accurate cutting, thereby help to improve the accuracy of rodent nasal mucosa tissue material taking.

The utility model belongs to the technical field of plate cutting machines, and particularly relates to a plate cutting machine with a dust removal structure, which comprises a rack and a notch, the notch is arranged on the upper side of the rack, a cutting tool apron is arranged above the notch, a driving motor is mounted on one side of the cutting tool apron, and a displacement arm is fixed on one side of the driving motor. According to the plate cutting machine with the dust removal structure, an exhaust fan is started, the exhaust fan drives airflow to flow, dust can be sucked into a collecting box through a collecting groove, dust generated by plates such as kicking plates is concentrated in the collecting box, workers can conveniently clean the dust generated by operation of the plate cutting machine, a limiting screw is rotated, and the dust removal efficiency is improved. The first connecting plate is moved, one side of a plate such as a kickplate is attached to the first connecting plate, a blade of the cutting tool apron is aligned with a surface mark point of the plate such as the kickplate, and the plate cutting machine can conveniently and accurately cut the plate such as the kickplate.

This invention discloses a high-precision electronic chip processing positioning device and its usage method, relating to the field of electronic chip processing positioning technology. It includes a plate, a rod, and a rotating plate. A control unit is mounted on the top of the plate, and the rod is also mounted on the top of the plate. A hydraulic telescopic unit is symmetrically mounted on one side of the rod and is electrically connected to the control unit. A moving frame is mounted on the output end of the hydraulic telescopic unit, and a rotating support mechanism is provided inside the moving frame. A laser ranging unit is mounted on one side of the rod and is electrically connected to the control unit. This invention places the wafer on the rotating plate, and then uses the laser ranging unit to measure the wafer's movement distance, thereby facilitating the placement of the processing positioning device below a cutting device for precise, evenly spaced cuts.

The present invention discloses a marking jig for dicing lanes in DFN and QFN packaging die-cutting processes, which relates to the technical field of marking jigs, and comprises a fixed frame, the top of which is connected with a vertical pole, a sliding unit and a storage box, and the sliding unit is located between four groups of vertical poles, the storage box is located on one side of the sliding unit, the surfaces of the four groups of vertical poles close to each other are connected with a material displacement unit, and the top of the vertical pole is connected with a lifting and pressing unit. The present invention is equipped with a lifting and pressing unit, an infrared receiving sensor and an infrared transmitting sensor, and the moving distance formula of the pressing plate is: d = h L ‑(h1+h2)+h3, d is the distance the press plate needs to move, h is L It represents the measured distance between the lamination plate and the film frame, h1 represents the thickness of the wafer, h2 represents the thickness of the blue film, and h3 represents the thickness of the scribe line. The thickness of the scribe line can be set according to the cutting needs to determine the moving distance of the lamination plate, thereby forming clear and accurate scribe lines on different wafers.