2results about How to "For accurate cutting" patented technology

The utility model relates to the technical field of rodent nose tissue pathological specimen material taking, specifically discloses rodent nasal mucosa tissue material taking device, the one side of fixed plate is provided with first fixed clamping groove and second fixed clamping groove respectively, is provided with head container on the fixed plate, is provided with first clamping groove insertion port, second clamping groove insertion port and cutting knife clamping groove on head container respectively, and the one side of head container is provided with scale, the rodent nasal mucosa tissue material taking device whole simple structure, and the installation and use are convenient, and the material taking work of rodent nasal mucosa tissue of staff is convenient, since setting up the scale for measuring distance on the bottom plate, a plurality of graduation grooves are opened on the scale, the position of rodent head tissue is measured through the scale, is convenient for its accurate cutting, thereby help to improve the accuracy of rodent nasal mucosa tissue material taking.

This invention discloses a high-precision electronic chip processing positioning device and its usage method, relating to the field of electronic chip processing positioning technology. It includes a plate, a rod, and a rotating plate. A control unit is mounted on the top of the plate, and the rod is also mounted on the top of the plate. A hydraulic telescopic unit is symmetrically mounted on one side of the rod and is electrically connected to the control unit. A moving frame is mounted on the output end of the hydraulic telescopic unit, and a rotating support mechanism is provided inside the moving frame. A laser ranging unit is mounted on one side of the rod and is electrically connected to the control unit. This invention places the wafer on the rotating plate, and then uses the laser ranging unit to measure the wafer's movement distance, thereby facilitating the placement of the processing positioning device below a cutting device for precise, evenly spaced cuts.