Semi-conductor silicon chip liquid stage source diffusion furnace

Abstract

This invention discloses a diffusion furnace of semiconductor silicon plate liquid source including: a diffusion tube and quartz tubes for spraying the source, in which, the diffusion furnace tube isin a structure of two ends open, 2-10 source-spraying quartz tubes are installed on the internal wall of the tube with the diameter of pha2-pha 10mm, capillary holes in uniform aperture are distributed on the wall of the tube and the exit end of the tube is connected with the source bottle of the liquid state diffusion source.

Description

technical field [0001] The invention relates to manufacturing equipment of semiconductor devices, in particular to a semiconductor silicon wafer liquid source diffusion furnace for performing a diffusion process on silicon wafers. Background technique [0002] Diffusion furnace tube is a thermal processing equipment used for diffusion, oxidation, annealing, alloying and sintering of silicon wafers in the manufacturing process of semiconductor devices and large-scale integrated circuits. At present, the known semiconductor diffusion equipment includes: a diffusion furnace tube and a quartz tube connected at the tail to provide a gas source. The disadvantages of this equipment are as follows: first, the diffusion furnace tube is a single-ended open structure, and the production efficiency is very low because the silicon wafers enter and exit through a single port before and after processing, and the time is relatively long. Second, the entry and exit time of silicon wafers du...

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Problems solved by technology

[0004] In order to solve the shortcomings of low production efficiency and poor diffusion uniformity in the prior art, the object of the present invention is to provide a semiconductor silicon wafer liquid source diffusion furnace, which adopts a continuous diffusion method to provide a uniform semiconductor impurity diffusion furnace tube structure

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