Encapsulation structure and its method for computer electric microphone

Abstract

A microcomputer electric microphone package structure comprises a carrier, a specific applying chip, a sealing colloid and a microphone chip. The specific applying chip is arranged on a first surface of the carrier, the microphone chip is arranged on a second surface of the carrier, the specific applying chip and the microphone chip are electrically connected to the carrier, the sealing colloid includes a first sealing colloid and a second sealing colloid, the first sealing colloid is arranged on the first surface to seal the specific applying chip, the second sealing colloid is arranged on the second surface and forms a holding space with the carrier, the microphone chip is arranged in the holding space. Because the specific applying chip and the microphone chip are respectively arrangedon the first and the second surfaces of the carrier, the second colloid is arround the microphone chip, and the first sealing colloid and the second sealing colloid can be formed entirely, the package structure intensity is increased and the producing steps are reduced.

Description

technical field [0001] The invention relates to a packaging structure of a micro-electromechanical microphone, in particular to a packaging structure of a micro-electromechanical microphone that can reduce the packaging size and increase the structural strength. Background technique [0002] As shown in Figure 1, the existing microchip microphone structure 10 includes a base 11, a backplane chip 12, a diaphragm chip 13 and a field effect transistor 14, and the backplane chip 12 is arranged on the base 11 And electrically connected to the base 11, the backplane chip 12 has a backplane electrode layer 12a and several through holes 12b, the diaphragm chip 13 has an electrode layer 13a, a diaphragm 13b and a spacer 13c, the diaphragm The film chip 13 is glued on the backplane chip 12 through the spacer 13c and is electrically connected to the field effect transistor 14. The field effect transistor 14 is arranged on the base 11 and is electrically connected to the base 11. When t...

AI Technical Summary

Problems solved by technology

However, as shown in FIG. 1 , to transmit electronic signals, the backplane electrode layer 12 a of the backplane chip 12 , the vibrating membrane 13 b and the electrode layer 13 a of the vibrating membrane chip 13 and the field effect transistor must be electrically connected. 14, and the backplane electrode layer 12a, the diaphragm 13b, the electrode layer 13a and the field effect transistor 14 all need to be electrically connected through the base 11, so many uncertainties are added to the manufacturing process, and The volume of the base 11 must be larger than the combination of the backplane chip 12, the diaphragm chip 13 and the field effect transistor 14 to protect the backplane chip 12, the diaphragm chip 13 and the field effect transistor 14, so that the existing The size of the microchip microphone structure 10 cannot be reduced

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