Semiconductor laser device, its manufacturing method and optical pickup head device using the same

Abstract

There is provided a semiconductor laser apparatus capable of sufficiently discharging heat generated at a semiconductor laser element, having a simple manufacturing step, and capable of adjusting an optical path length, as well as a method for manufacturing the same. A laser chip is connected through a block and a plate to a housing. Further, the plate is partially exposed from a connecting surface between the block and the plate, and when disposed in the housing, the semiconductor chip and the block are inserted from an outside of the housing to an inside thereof, and the plate is exposed outwardly from the housing. An optical axis of an output light beam from the laser chip is in parallel to a ground plane of the housing.

Description

technical field [0001] The present invention relates to a semiconductor laser device suitable for being installed in an optical disc recording and reproducing device, its manufacturing method and an optical pick-up head device using the device. Background technique [0002] In an optical drive such as a CD (Compact Disc) drive or a DVD (Digital Versatile Disc) drive, an optical pickup device for recording and reproducing data includes a semiconductor laser element as a light source and a light receiving element that receives reflected light from the disc. And constitute. The laser light emitted from the light source is adjusted so that the light spot on the CD or DVD recording surface is minimized. The laser light reflected on the recording surface is received by a photodetector and converted into data. [0003] Lasers with a wavelength of 790nm are used for CDs, lasers with a wavelength of 650nm are used for DVDs, and lasers with a wavelength of 405nm are used for next-ge...

AI Technical Summary

Problems solved by technology

However, it is difficult to dissipate the heat generated by the light-emitting element sufficiently because it is only dissipated from the case body. Therefore, if the semiconductor laser device is used for a long time, the light-emitting element will gradually deteriorate, which may damage reliability and shorten the life.

In addition, since the optical axis of the emitted light from the light emitting element is deflected due to the influence of the deformation of the housing through the substrate lead and the frame, the reliability of the semiconductor laser device is impaired.

[0006] In addition, the semiconductor laser device 20 shown in FIG. 8 is fixed on a surface perpendicular to the optical axis of the outgoing light from the semiconductor laser device 20, so by adjusting the position of the through hole provided on the housing, it can be aligned with the outgoing light. The position adjustment is performed on the plane perpendicular to the optical axis of the emitted light, but the position adjustment in the direction of light emission, that is, the adjustment of the optical path length from the emitting position of the laser to the irradiation position cannot be performed.

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