Module support device
A technology of a support device and a support element, which is applied to the circuit layout, printed circuit components and other directions on the support structure, can solve the problems of the tilt of the module 10 and the poor fixing effect of the tape 40, and achieve the effect of avoiding shaking or tilting
Inactive Publication Date: 2008-04-02
DELTA ELECTRONICS INC
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As shown in Figure 2, in order to strengthen and fix the module 10 on the system circuit board 20, the module 10 can also be fixed on the system circuit board 20 on the electronic components 23 around the module 10 by using the adhesive tape 40, but the fixing effect of the adhesive tape 40 is not good. Good, and if the module 10 is slightly higher, there will be pulling and shaking, which will cause the module 10 to tilt
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0043] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the invention is capable of various changes in various ways without departing from the scope of the invention, and that the description and drawings therein are illustrative in nature rather than limiting the invention.
[0044] Please refer to FIG. 4 , which is a functional diagram of the module supporting device according to a preferred embodiment of the present invention, wherein the module can be a power module or other functional modules, such as an image processing module, a display module or other circuit modules. As shown in FIG. 4 , the module 10 includes a module circuit board 11, a plurality of electronic components 12, a plurality of pins (pin) 13 and a heat sink 14, wherein the module circuit board 11 is vertically arranged on the system circuit board 20 , and through...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention is a support structure of a circuit module which includes a module circuit board vertically mounted on a system circuit board. The support structure includes a first supporting member and a second supporting member. The first supporting member is arranged on a first side of the module circuit board and includes a first bottom surface lying flat on the system circuit board. The second supporting member is arranged on a second side of the module circuit board and includes a second bottom surface lying flat on the system circuit board, wherein the second side is opposed to the first side. The first supporting member and the second supporting member cooperatively clamp the module circuit board therebetween. Since the support structure of a circuit module is mounted on the system circuit board, the electronic elements on the support structure can avoid from contacting the electronic element to the system circuit board, which results in short-circuit, function reduction or loss or even damage during the process of wave soldering when the modules are sloshing or inclining.
Description
technical field [0001] The invention relates to a module support device, in particular to a module support device which provides support to prevent the module from tilting when the module is vertically arranged on a system circuit board. Background technique [0002] In order to cater to the development trend of thin, light and small electronic equipment, many electronic components are modularized and vertically arranged on the system circuit board to reduce the volume occupied by electronic components, increase the electronic density, and increase the space utilization of the system circuit board. In view of the fact that the vertical module may shake or tilt left and right during wave soldering processing or operation, so that the electronic components on the module collide with the electronic components on the system circuit board, resulting in short circuit, function reduction or failure, or even For the problem of burn-in, there are several ways to fix the strengthening...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/02H05K1/02
Inventor 陈鸿琦
Owner DELTA ELECTRONICS INC