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Single plate structure

A single board and baffle technology, applied in the fields of magnetic field/electric field shielding, electrical components, etc., can solve the problems of poor EMI suppression performance, different noise discharge paths, waste of time and cost, etc., to avoid single connection method, reduce cost effect

Active Publication Date: 2008-04-30
RUIJIE NETWORKS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The present invention provides a single board structure to solve the problem of time and cost waste caused by the single connection mode of the existing PGND and GND and the problem of poor EMI suppression performance caused by the inconsistency of the noise discharge path caused by the single-point connection, so as to realize PGND The connection to GND can be designed, which improves design flexibility, saves time and cost, and is more conducive to suppressing EMI

Method used

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Embodiment 3

[0030] Embodiment 3, through the distribution of the screw holes in the working area, soldering points are reserved for the connection between the working area and the ground, and the screw holes are distributed according to the positions of the sensitive circuit modules, so that the sensitive circuit modules can be provided with the closest noise leakage. It is beneficial to suppress EMI; at the same time, by reserving welding points in the protected area and the working area, the connection mode between the working area and the protected area can be flexibly selected according to the actual application, and the type of noise discharge path can be flexibly selected. The choice of multi-point connection or single-point connection avoids the risk of redesigning and re-manufacturing the board when changing the connection mode between the working area and the protection area, and saves time and cost.

[0031] The side views of Embodiment 1 and Embodiment 2 of the veneer structure ...

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Abstract

The invention relates to a veneer structure. The working site area of a stratum signal layer of the veneer structure is equipped with screw holes and the surface signal layer is equipped with a first bonding pad pair, which is positioned in the stratum signal layer working site area when mapping on the stratum signal layer, or / and the surface signal layer is equipped with a second bonding pad pair, which is positioned between the stratum signal layer working site area and a protection site area when mapping on the stratum signal layer. The invention reserves welding points for the connection of the protection site area and the working site area, with flexible design, and time and cost saving.

Description

technical field [0001] The invention relates to a single board structure, in particular to a single board structure capable of effectively suppressing electromagnetic interference. Background technique [0002] As shown in Figure 1, in a large communication system, the chassis is used to place, fix and interconnect communication modules. The chassis includes a backplane and a single board. For power supply, the single board is plugged into the backplane and connected to the chassis through the metal guide rail on the chassis for communication between signals. A single board generally includes a printed circuit board (Print Circuit Board, hereinafter referred to as PCB), a metal baffle, and metal screws. The PCB and the metal baffle are fixedly connected by metal screws. Layer signal layer S2, ground layer G, and dielectric layer M (insulation layer); each layer is connected through a via hole H1 or a screw hole, and the via hole H1 is used for electrical switching of signal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
Inventor 彭泽林
Owner RUIJIE NETWORKS CO LTD
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