Exposure device

Abstract

The invention provides an exposure device which is high in accuracy and can have the exposure time shortened. A lighthouse (1) is elevated so as to contact a film mask (2) to a substrate (90) and then to form an enclosed place (40). A pressure reducing pump (60) is used for reducing the pressure. A one-time enclosure between the film mask (2) and the substrate (90) is conducted. Then, a pressurized air with a pressure ranging from 1kPa to 20kPa is led in from a guide hole (52), thus forming a pressuring space (25) between the film mask (2) and a piece of glass (30). The film mask (2) and the substrate (90) are further sealed, thus completing a second enclosure. As the first enclosure has made the film mask (2) and the substrate (90) sealed, a small amount of air in the guide hole (52) can be led in, and also a small amount of air is blown out under the inflation during the pressurizing. So the inside guide of the air can be fulfilled in a short period of time, without such defect as the deformation due to the inflation of the film mask (2).

Description

technical field [0001] The present invention relates to an exposure device used for a printed wiring board. Background technique [0002] In recent years, printed wiring boards are manufactured using exposure equipment, and photolithography (photolithography) is used as a manufacturing method. A predetermined pattern is sensitized and then etched to form a pattern on the substrate. [0003] In this exposure apparatus, generally, a resin film mask is mainly used as an original plate on which a pattern original is drawn, and the film mask is held on a glass mask holder for use. And in order to improve the adhesiveness between this film mask and a board|substrate, the so-called vacuum sealing method which draws a vacuum between them and makes them adhere|attach is often used. [0004] This vacuum sealing method is effective when the substrate surface is flat, but if the substrate surface has unevenness or undulations, the mask may not follow the substrate, resulting in poor m...

AI Technical Summary

Problems solved by technology

[0008] However, in the case of using the method of opening the space between the film mask and the mask holder to the atmosphere in Patent Document 1, there is a problem that sufficient adhesion of the film mask cannot be obtained due to insufficient pressure.

Moreover, only constant pressure such as atmospheric pressure can be used, and there is a problem that it is difficult to obtain the best adhesion according to various conditions by changing the pressure.

[0009] On the other hand, in the case of adopting the configuration of Patent Document 2 in which the back side of the film mask is pressurized in advance before vacuum sealing, there is a problem that the process of bonding the film will take longer because the pressurization takes time.

In addition, there are also problems such as the possibility of deformation such as elongation of the film mask

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