Unlock instant, AI-driven research and patent intelligence for your innovation.

Gas injection apparatus

A gas injection and gas channel technology, applied in electrical components, semiconductor/solid-state device manufacturing, discharge tubes, etc., can solve the problems of complex nozzle structure, difficult processing, unfavorable uniform gas distribution, etc., to achieve uniform gas distribution, Simple structure and easy processing effect

Inactive Publication Date: 2008-06-11
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the gas inlet channels and gas outlets of the device are all distributed on the nozzle, resulting in a complex structure of the nozzle and difficulty in processing, and the gas directly enters the chamber from the nozzle inlet channel, which is not conducive to the uniform distribution of the gas.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Gas injection apparatus
  • Gas injection apparatus
  • Gas injection apparatus

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 2

[0033] Specific embodiment two, such as Figure 4 As shown, the lower part of the nozzle 1 is provided with an outer flange 22, and the outer flange 22 is matched with the inner surface of the installation hole, and an air injection hole 20 is arranged at the matching place.

specific Embodiment 3

[0034] In the third embodiment, an inner flange 21 is provided at the lower part of the installation hole, and an outer flange 22 is provided at the lower part of the nozzle 1, and the outer flange 22 cooperates with the inner flange 21, and an air injection hole 20 is provided at the matching place.

[0035] The gas injection hole 20 may have one, which is an annular gas injection hole, and is arranged in a ring along the mating surface of the installation hole and the nozzle 1;

[0036] There can also be a plurality of gas injection holes 20, which are evenly distributed along the mating surface between the lower part of the mounting hole and the nozzle, and there can be 4, 6, 8, 10, 12 preferred numbers, the best being 8.

[0037] The central gas channel 11 and the peripheral gas channel 10 are respectively provided with gas supply channels, and flow control elements 4 are respectively provided on the respective gas supply channels, so as to control the flow of the central g...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an air injection device, which comprises a nozzle which is arranged in an installation hole of an upper cover plate of a reaction cavity, a central air channel and peripheral air channel. The upper part of the installation hole matches with the nozzle, while a sealing hollow cavity is formed between the middle part and the nozzle. The upper part of the sealing hollow cavity is communicated with the peripheral air channel, while the lower part is communicated with the reaction cavity. The air channel is not completely arranged on the nozzle, but a part of the air channel is formed by matching the nozzle and the upper cover plate. The invention allows the nozzle to have a simple structure and be easy to manufacture. The sealing hollow cavity has flow stabling and buffering functions for air, thereby being favorable for uniformity of air distribution. The invention is particularly applicable to the air supplying system in semi-conductor wafer manufacture device, or applicable to air supply in other occasions.

Description

technical field [0001] The invention relates to a gas distribution system, in particular to a device for supplying gas to a semiconductor wafer processing chamber. Background technique [0002] During semiconductor wafer processing, process gas is injected into the reaction chamber by the gas injection device and diffused, and plasma is generated under the action of a high-frequency electric field to etch the wafer surface inside the chamber. Inside the reaction chamber, if the gas distribution is not uniform, it will lead to large variations in the etching rate and uniformity on the wafer surface inside the chamber. At present, with the advancement of technology, the volume of the reaction chamber increases accordingly, which makes it more difficult to evenly distribute the gas in the reaction chamber. Therefore, it is very important to design a gas injection device that can obtain uniform gas distribution. [0003] At present, in the process gas injection system used in s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3065H01L21/00H01J37/32
Inventor 王志升
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD