Sheet adhering apparatus and sheet adhering method

A sheet sticking device and sheet technology, applied in the directions of adhesives, electrical components, circuits, etc., can solve the problems of chip fragmentation, inappropriateness, sheet consumption, etc., and achieve the effect of eliminating unnecessary consumption and avoiding wrinkling.

Active Publication Date: 2008-07-02
LINTEC CORP
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for an extremely thin sheet-like part that has been ground to several tens of microns, such as a wafer, if a sheet with traces of recesses is used, the thickness will become uneven or the wafer will be broken during grinding. The area cannot be used as an area for pasting to the wafer
Therefore, although it is sufficient to convey the sheet so as not to include the above-mentioned concave region, it is not suitable because the sheet will be consumed for no reason.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sheet adhering apparatus and sheet adhering method
  • Sheet adhering apparatus and sheet adhering method
  • Sheet adhering apparatus and sheet adhering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Embodiments of the present invention will be described below with reference to the drawings.

[0045] FIG. 1 is a schematic front view showing a sheet sticking device according to the present embodiment, and FIG. 2 is a schematic perspective view showing the same. In these figures, the sheet sticking apparatus 10 is composed of the following components: a sheet guide unit 12 arranged on the upper part of the base 11; a table 13 supporting a wafer W as a plate-shaped member; The pressure roller 14 that sticks the adhesive sheet S on the upper side to the wafer W by applying a pressing force; and the cutter 15 that cuts the adhesive sheet S along the outer edge of the wafer W after the adhesive sheet S is attached to the wafer W; and a peeling device 16 for peeling the unnecessary adhesive sheet S1 on the outer side of the wafer W from the upper surface of the table 13; and a take-up device 17 for winding the unnecessary adhesive sheet S1.

[0046] The above-mentioned sh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A sheet sticking device (10) comprises: a sheet guide unit (12) for guiding an adhesive sheet (S) to a position facing a semiconductor wafer (W); and applying a pressing force to the above-mentioned adhesive sheet (S), A pressure roller (14) for attaching the adhesive sheet (S) to the wafer W. The above-mentioned sheet guide unit (12) includes a tension measurement mechanism (35) for measuring the tension of the adhesive sheet (S) between the guide head (49) and the pressing roller (14), the tension measurement mechanism (35), through the Keeping the above tension constant can prevent air bubbles from being mixed between the adhesive sheet (S) and the wafer (W) and warpage of the wafer after the sheet is pasted.

Description

technical field [0001] The present invention relates to a sheet sticking device and a sticking method. More specifically, the present invention relates to a sheet sticking device capable of sticking a sheet to a specified position of a plate-shaped part with high precision when sticking a sheet to a plate-shaped part such as a semiconductor wafer. Device and paste method. Background technique [0002] Traditionally, on a semiconductor wafer (hereinafter referred to as "wafer"), a protective sheet for protecting the circuit surface is generally pasted, or an adhesive sheet for chip bonding is pasted on the back thereof. [0003] There is known such a sheet sticking method (for example, refer to Patent Document 1): use a kind of roll paper (raw material sheet) that temporarily sticks the tape-shaped adhesive sheet on the tape-shaped release sheet, After the tab is peeled and attached to the wafer, it is cut along the periphery of the wafer. [0004] Patent Document 1 Japanes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/67132Y10T156/10Y10T156/17H01L21/683
Inventor 野中英明中田干小林贤治
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap