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Modularized semiconductor light source

A light source device and semiconductor technology, applied in semiconductor devices, light sources, electric light sources, etc., can solve the problems of poor light concentration and heat dissipation, achieve the best heat dissipation effect and increase the heat dissipation area.

Inactive Publication Date: 2008-07-16
LEADER ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the applicant of the present invention has been engaged in the design, production and sales of semiconductor light source devices for many years, hoping to improve the many shortcomings of the aforementioned semiconductor light source devices in terms of light concentration and poor heat dissipation. After repeated experiments and tests, he developed the Modular semiconductor light source device of the present invention

Method used

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  • Modularized semiconductor light source
  • Modularized semiconductor light source
  • Modularized semiconductor light source

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Embodiment Construction

[0020] In order to further disclose the specific technical content of the present invention, first please refer to the accompanying drawings, wherein, figure 1 It is a three-dimensional exploded view of the modularized semiconductor light source device of the present invention, figure 2 It is a sectional view after the present invention is assembled, image 3 It is a perspective view of the present invention after assembly, and Fig. 4 is a perspective view of another embodiment of the modularized semiconductor light source device of the present invention, Figure 5 It is a perspective view of another embodiment of the modularized semiconductor light source device of the present invention, Image 6 It is a schematic diagram of another embodiment of the cup cover of the present invention, Figure 7 It is a schematic diagram of yet another embodiment of the cup cover of the present invention.

[0021] Such as Figure 1 to Figure 3 As shown, basically, the modularized semicon...

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Abstract

The invention discloses a modularized semiconductor light source device which comprises a light source module, at least one semiconductor chip and a cup cover; the light source module is formed by transversely arranging a heat-conducting plate in a hollow body which forms a light outlet in front and a via hole in the bottom; wherein, the heat-conducting plate is provided with at least one welding surface which is provided with at least one welding pad; the semiconductor chip selectively attaches to the welding surface of the heat-conducting plate and is electrotactically connected with an expected welding pad; the cup cover is combined on the bottom of the body to seal the via hole and is provided with a light-condense reflecting surface. When the semiconductor chip is lighted, the heat energy generated is transferred to the body through the heat-conducting plate, and then the light is reflected by the reflecting surface of the cup cover and is projected out from the light outlet.

Description

technical field [0001] The invention relates to a semiconductor light source device, especially a modularized semiconductor light source device, which is a modularized semiconductor light source device that combines a light source module and a cup cover to gather light and dissipate heat. Background technique [0002] According to the known light source devices, most of them use lamps, such as various light bulbs such as incandescent lamps, halogen lamps or fluorescent lamps, as the light sources of the light source devices. In recent years, semiconductor chips such as Light Emitting Diodes (LEDs) have gradually replaced traditional light sources and become extremely popular light sources due to their advantages of small size, power saving and long life. [0003] For the structure of semiconductor light source devices, multi-chip, high-power LED packaging has become an inevitable trend requirement. For example, US Patent No. 6,492,725 with the patent title: Concentrically L...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V5/04F21V7/00F21V17/00H01L25/075H01L23/36F21Y101/02F21K9/237F21V29/50F21V29/74F21Y115/10
CPCH01L2924/0002
Inventor 包忠诒陆瑾言刘念慈陈国禔
Owner LEADER ELECTRONICS
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