Cooling type semiconductor packaging member

Abstract

The invention discloses a radiation semiconductor package, comprising a substrate which is provided with a plurality of welding pads and grounding pads on the surface, semiconductor chips which are arranged on the substrate and electrically connected with the welding pads, passive components which are arranged on the welding pads of the substrate, zero resistance passive components or metal blocks which are arranged on the grounding pads of the substrate, and radiation fins which can be arranged on the zero resistance passive components or metal blocks, wherein, the radiation fins are electrically connected with the zero resistance passive components or metal blocks, and are electrically coupled with the grounding pads of the substrate to form a ground, thereby providing an EMI blackout effect, preventing the problems of increased cost of structure process and material consumption generated when the prior heat conductive structure provided with a supporting part is arranged on the substrate through the supporting part, and preventing the problem of arrangement of electronic components on the substrate restricted by the arrangement of the supporting part.

Description

technical field [0001] The invention relates to a semiconductor package, in particular to a semiconductor package integrated with a heat dissipation structure. Background technique [0002] With the demand for thinner, lighter and smaller electronic products, the Ball Grid Array (BGA) Semiconductor Package (Ball Grid Array Semiconductor Package) can provide a sufficient number of input / output connection terminals (I / O Connection) to meet the requirements of high-density electronic products. The demand for components and semiconductor chips for electronic circuits has gradually become the mainstream of packaged products. However, since this kind of semiconductor package provides higher density electronic circuits (Electronic Circuits) and electronic components (Electronic Components), the heat generated during operation is also relatively high. If the heat on the chip surface is not quickly released in real time , The accumulated heat will seriously affect the electrical fun...

AI Technical Summary

Problems solved by technology

[0009] However, in the aforementioned heat-dissipating semiconductor package, because the supporting part of the heat-dissipating structure is located outside the preset plane size of the semiconductor package, that is, the supporting part is not in the semiconductor package after the cutting operation, so the heat dissipation cannot be achieved. The structure is connected and electrically connected to the substrate ground area to form a ground loop (ground), but it cannot provide shielding effect against electromagnetic interference (EMI)

[0010] In addition, although U.S. Patent No. 5,877,552 discloses that the supporting part of the heat dissipation structure can be connected and electrically connected to the substrate grounding area, but because the supporting part is directly placed in the half-body package package, the above-mentioned substrate space will be wasted. Limit the configuration of passive components

That is to say, the heat dissipation structure still has to rely on the supporting part to be connected to the substrate, so it will still cause a waste of valuable space on the substrate

[0011] Furthermore, the heat dissipation structures disclosed in the above-mentioned prior art all have to be prepared with supporting parts for the heat dissipation structures to be placed on the substrate. The cost of materials is increased, which in turn increases the cost of the process

Images