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Electronic assembly for image sensor device and fabrication method thereof

An image sensing device and packaging module technology, which is applied in the direction of assembling printed circuits with electrical components, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as influence and poor device performance, and achieve the effect of reducing manufacturing costs.

Active Publication Date: 2008-07-16
VISERA TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the packaged modules or electronic components cannot be designed with EMI protection, the performance of the device will be adversely affected

Method used

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  • Electronic assembly for image sensor device and fabrication method thereof
  • Electronic assembly for image sensor device and fabrication method thereof
  • Electronic assembly for image sensor device and fabrication method thereof

Examples

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Embodiment Construction

[0022] The manufacture and use of the embodiments of the present invention are described below. It should be readily appreciated, however, that the present invention provides many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments are only used to illustrate the manufacture and use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0023] Figure 1 shows the electronic components used in the image sensing device known to the inventors of the present invention, which is not the prior art used to determine the patentability of the present invention, but only to demonstrate the inventors' discovery of the present invention The problem.

[0024] Referring to FIG. 1 , the electronic component includes an image sensor chip scale package (chip scale package, CSP) module and a lens set 200 , which are sequentially assembled on a printed circuit board (PCB) 3...

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Abstract

The invention discloses a packaging module used for an image sensing device, an electronic component and the production method. Wherein the packaging module comprises a device chip arranged between a lower substrate and an upper substrate; a conducting layer arranged at the side wall of the lower substrate and insulated with the device chip; a protective layer arranged at the conducting layer and exposing part protective layer of the side wall of the lower substrate; a bonding pad arranged at the lower surface of the lower substrate, electrically connected to the conducting layer. The invention can resolve EMI problem without using metal casing for EMI protection, thereby reducing the production cost.

Description

technical field [0001] The present invention relates to an image sensing device technology, in particular to a packaging module and an electronic component with electromagnetic interference (electromagnetic interference, EMI) protection for an image sensing device. Background technique [0002] Charge-coupled device (CCD) image sensing devices and complementary metal oxide semiconductor (CMOS) image sensing devices are widely used in digital image products. Image capture techniques are also well known to consumers due to the increased usage of image sensing devices such as digital cameras, digital image recorders, camera phones and monitors, among others. [0003] An image sensing device typically includes a diode array for pixels, a control circuit, an analog-to-digital converter, and an amplifier. Regardless of whether these devices are on the same chip, such as a sensor device, or in a camera module or on a printed circuit board (PCB), preventing electromagnetic interfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/552H01L21/50H05K1/18H05K3/32H05K9/00
CPCH01L2224/11H01L2224/16225
Inventor 陈腾盛戎柏忠林孜翰熊信昌
Owner VISERA TECH CO LTD
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