Electronic assembly for image sensor device and fabrication method thereof

An image sensing device and packaging module technology, which is applied in the direction of assembling printed circuits with electrical components, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as influence and poor device performance, and achieve the effect of reducing manufacturing costs.

Active Publication Date: 2008-07-16
VISERA TECH CO LTD +1
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the packaged modules or electronic components cannot be designed with EMI protection, the performance of the device will be adversely affected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic assembly for image sensor device and fabrication method thereof
  • Electronic assembly for image sensor device and fabrication method thereof
  • Electronic assembly for image sensor device and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The manufacture and use of the embodiments of the present invention are described below. It should be readily appreciated, however, that the present invention provides many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments are only used to illustrate the manufacture and use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0023] Figure 1 shows the electronic components used in the image sensing device known to the inventors of the present invention, which is not the prior art used to determine the patentability of the present invention, but only to demonstrate the inventors' discovery of the present invention The problem.

[0024] Referring to FIG. 1 , the electronic component includes an image sensor chip scale package (chip scale package, CSP) module and a lens set 200 , which are sequentially assembled on a printed circuit board (PCB) 3...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a packaging module used for an image sensing device, an electronic component and the production method. Wherein the packaging module comprises a device chip arranged between a lower substrate and an upper substrate; a conducting layer arranged at the side wall of the lower substrate and insulated with the device chip; a protective layer arranged at the conducting layer and exposing part protective layer of the side wall of the lower substrate; a bonding pad arranged at the lower surface of the lower substrate, electrically connected to the conducting layer. The invention can resolve EMI problem without using metal casing for EMI protection, thereby reducing the production cost.

Description

technical field [0001] The present invention relates to an image sensing device technology, in particular to a packaging module and an electronic component with electromagnetic interference (electromagnetic interference, EMI) protection for an image sensing device. Background technique [0002] Charge-coupled device (CCD) image sensing devices and complementary metal oxide semiconductor (CMOS) image sensing devices are widely used in digital image products. Image capture techniques are also well known to consumers due to the increased usage of image sensing devices such as digital cameras, digital image recorders, camera phones and monitors, among others. [0003] An image sensing device typically includes a diode array for pixels, a control circuit, an analog-to-digital converter, and an amplifier. Regardless of whether these devices are on the same chip, such as a sensor device, or in a camera module or on a printed circuit board (PCB), preventing electromagnetic interfer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/552H01L21/50H05K1/18H05K3/32H05K9/00
CPCH01L2224/11H01L2224/16225
Inventor 陈腾盛戎柏忠林孜翰熊信昌
Owner VISERA TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap