Platform and method for adsorbing glass substrate

Abstract

The invention discloses a platform and a method for absorbing a glass substrate, wherein the platform is suitable for one liquid crystal display production machine station, the platform comprises a body and an extension, the body is provided with an adsorption face, the extension is at one side of the body, which two ends are respectively extended outwards toward two relative ends of the body, the adsorption face is provided with a first induction hole, the extension is provided with a second induction hole, the first and second induction holes can absorb one glass substrate on the platform when in air induction to mount chip on the glass substrate. The invention further discloses a glass substrate adsorption method of the platform.

Description

technical field [0001] The invention relates to a platform, in particular to a platform for absorbing a glass substrate for mounting chips on the glass substrate. Background technique [0002] The traditional method of making Chip-On-Glass (COG) is to use a COG crimping machine. The working principle of the COG crimping machine is to use the conductive particle film (ACF) to drive the chip under high temperature and certain pressure. The firm connection between the circuit chip and the glass substrate, so as to connect the circuit between the driving circuit chip and the glass substrate, and use an image recognition system to detect the preset positioning marks on the glass substrate to determine the driving circuit chip on the glass substrate position, so that the driver circuit chip is set on the correct position on the glass substrate. [0003] However, due to the increasing size of the glass substrate, when the glass substrate is placed on the COG crimper and waits for ...

AI Technical Summary

Problems solved by technology

[0003] However, due to the increasing size of the glass substrate, when the glass substrate is placed on the COG crimper and waits for the driver circuit chip to be crimped, the glass substrate itself will warp and curl. Therefore, the image recognition system cannot accurately detect The correct position of the positioning marks on the glass substrate will lead to wrong positioning operations, and the driver circuit chip will be crimped on the wrong position of the glass substrate. In severe cases, the glass substrate may be damaged, which will waste material costs and labor costs, causing inconvenience to manufacturers and Therefore, if we can develop a platform that can absorb the glass substrate, the two ends of the glass substrate can reduce the curvature of the upward curl, reduce the chance of crimping the driver circuit chip on the wrong position of the glass substrate, and avoid waste Material cost and labor cost have become an important issue to be solved urgently

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