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Anodic oxidation and sealing hole washing-free hole sealing technology

A technology of anodic oxidation and process technology, which is applied in the field of sealing technology without water washing between anodic oxidation and sealing, which can solve the problems of loss of sealing function and other problems, achieve shortening of working length, shortening of sealing process time, and reduction of process cost Effect

Inactive Publication Date: 2008-07-30
李文志
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AI Technical Summary

Problems solved by technology

The invention successfully solves the problem that the original sealing liquid can quickly lose the sealing function due to the entrained sulfuric acid when the aluminum workpiece is moved into the sealing process pool without washing with water after anodic oxidation

Method used

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  • Anodic oxidation and sealing hole washing-free hole sealing technology

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Embodiment Construction

[0014] Sealing solution formula and formula principle

[0015] The liquid formula for the water-free sealing process between anodic oxidation and sealing of aluminum workpieces is divided into two parts: the basic sealing liquid formula and the sealing supplementary liquid formula.

[0016] 1. Process formula

[0017] A. Basic sealing fluid formula

[0018] Sodium dihydrogen phosphate NaH 2 PO 4 2H 2 O 50g / l

[0019] Aluminum Sulfate Al 2 (SO 4 ) 3 18H 2 O 1g / l

[0020] Potassium fluoride KF·2H 2 O 0.8g / l

[0021] After dosing, the naturally formed PH value of the solution is about 6, and the medicinal solution is slightly turbid. At this time, it is necessary to use 3 to 4N sulfuric acid H 2 SO 4 After lowering the pH value of the solution to 2, the medicinal solution will become very clear. Then use 6-8N sodium hydroxide NaOH solution to raise the pH value of the liquid to 4 o'clock, so that the liquid has reproduced a slight mixed corrosion. When this situat...

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Abstract

The invention relates to a washing-free hole-sealing process technique between anode oxidation and hole sealing. The invention brings the potential of the hole-sealing solution in the new technique mode into full play and utilizes the sulphuric acid received from the previous technique process to get involved in the hole-sealing reaction, thereby causing the research, development and application of the new hole-sealing prescription more logical and abolishing the middle washing procedure between the period that after the anodic oxidation of the aluminum workpiece and before the hole-sealing technique. The total duration for the whole hole-sealing process is shortened from 65 to 75 seconds for the prior technique to 30 seconds or so for the new technique, the sealing rate of the oxide film after the hole-sealing treatment is enhanced by 30 percent, and the wearing resistance of the oxide film is boosted by 70 percent and the alkali-proof performance of the oxide film is increased by 50 percent. In addition, the process length of the electrochemical section in the production line is shortened by 40 percent and the process cost is accordingly decreased by 35 to 40 percent. All the improvements facilitate the invention to be a good partner for the hole-sealing technique in the production line of PS printing plates and CTP plates.

Description

technical field [0001] It is an oxide film sealing technology that eliminates the water washing process between the anodic oxidation and sealing of aluminum workpieces in the aluminum surface treatment technology. Background technique [0002] Since the birth of aluminum anodic oxidation technology, aluminum workpieces must be fully washed with water immediately after the anodic oxidation process in the sulfuric acid electrolyte before being moved into the sealing process pool to pore the microporous oxide film formed on the surface of the workpiece. closed work. [0003] At present, the working pH value of several sealing process solutions popular in the industry is still delineated in a relatively narrow range of slightly acidic or moderately alkaline. If the workpiece just removed from the anodizing process pool is directly put into the sealing process pool without washing, it will be stained with too much sulfuric acid in the previous process and enter the sealing solut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/18C25D11/24
Inventor 李文志
Owner 李文志
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