Method for producing tiny soldered balls with repeatedly-usable substrates

A substrate and solder ball technology, applied in the field of preparing tiny solder balls, can solve the problems of easy introduction of various impurities, poor process controllability, ineffective control of droplet size and continuous growth, etc., to avoid surface oxidation, wire drawing or fluffing Phenomenon, reduce production cost, avoid fragmentation burr and adhesion effect
CN101246828BInactive Publication Date: 2010-06-02SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
Publication Date
2010-06-02
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a method for manufacturing a small solder ball, in which a substrate is reusable. The invention is characterized in: firstly, the reusable substrate is prepared by means of ICmanufacture process: a silicon wafer is used as a base, a metal conducting layer is sputtered from the front after heat oxidation treatment; secondly, the small solder ball is manufactured on the reusable substrate: a metal sacrificial layer is sputtered on the substrate to cover the opening of the conducting layer, thick photosensitive resist is coated and an electroplating window is photoetched, then solder is electroplated, the thick photosensitive resist is removed after electroplating, the solder is reflowed to form a solder ball, thereafter the metal sacrificial layer is corroded to beremoved, so that the solder ball can drop off completely from the reusable substrate, and finally the solder ball is collected. According to the invention, the manufacturing procedure is simple and consumes small energy, the process has good controllability, the bottleneck of low productivity is overcome; the manufactured solder ball has smooth surface, good sphericity and uniform size, with the smallest grain diameter being 0.15mm.
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Description

technical field

[0001] The invention relates to a method for preparing tiny solder balls with reusable substrates, belonging to the field of electronic packaging. Background technique

[0002] With the rapid development of consumer electronic products towards "light, thin, short, small" and multi-functionalization, higher requirements are put forward for electronic assembly technology, forcing packaging technology to be high-density, miniaturized, and integrated. direction evolution. New high-density packaging technologies are constantly emerging, and area array packaging forms such as Ball Grid Array (BGA) and Chip Scale Package (CSP) will become the mainstream of future high-density packaging technologies. In BGA and CSP packaging processes, precision solder balls are used instead of pins to realize electrical and mechanical connections between circuit substrates and chips, which has become a key material for electronic packaging. Advanced electronic packaging has very s...

Claims

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