Scribing method for brittlement substrate web with precision laser and special-purpose equipment

A special equipment and base material technology, which is applied in the field of precision laser scribing of brittle base materials and special equipment, can solve the problems of difficulty in ensuring the coincidence accuracy of scribe lines on the upper and lower sides, and low efficiency, so as to improve cost performance, competitiveness, and guarantee Machining accuracy, machining efficiency, and the effect of reducing precision requirements
CN101254573AInactive Publication Date: 2008-09-03江苏伊施德创新科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江苏伊施德创新科技有限公司
Publication Date
2008-09-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for precisely scribing brittle substrate by using laser, which can ensure the superposition accuracy of an upper and a lower scribed lines and can improve the scribing efficiency. The invention also provides special equipment for precisely scribing brittle substrate by using laser. The special equipment comprises an X-Y displacement workbench and laser heads, and is characterized in that the equipment has at least a pair of laser heads and two aligned laser heads are adopted for simultaneously scribing the same line on the front and the back sides of the substrate.
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Description

(1) Technical field

[0001] The invention relates to a precision laser scribing method for brittle substrates, and also relates to a special equipment for precision laser scribing brittle substrates. (2) Background technology

[0002] In the manufacture of electronic micro components, such as the manufacturing process of miniature chip ceramic resistors or chip capacitors, it is finally necessary to split the neatly arranged resistors or capacitors on the ceramic substrate into individual resistor elements by means of splits, so that For subsequent processing, packaging and use, see Figure 1, Figure 2, and Figure 3. However, in the prior art, a molding method is used for larger-sized chip resistance elements, and a lot of lines are pre-pressed on the unfired, soft green ceramic sheet. After the ceramic sheet is fired, the lines are still maintained on the surface of the ceramic substrate. Can be used for final sharding. However, the disadvantage of this method is that the a...

Claims

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