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Scribing method for brittlement substrate web with precision laser and special-purpose equipment

A special equipment and base material technology, which is applied in the field of precision laser scribing of brittle base materials and special equipment, can solve the problems of difficulty in ensuring the coincidence accuracy of scribe lines on the upper and lower sides, and low efficiency, so as to improve cost performance, competitiveness, and guarantee Machining accuracy, machining efficiency, and the effect of reducing precision requirements

Inactive Publication Date: 2008-09-03
江苏伊施德创新科技有限公司
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Problems solved by technology

The disadvantage of the above scheme is that it is not easy to ensure the coincidence accuracy of the marking lines on the upper and lower sides, which puts forward high requirements on the movement accuracy of the X-Y platform and the alignment of optical recognition; in addition, there is another obvious disadvantage, that is, the lines need to be drawn separately on both sides, and the efficiency is too low

Method used

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  • Scribing method for brittlement substrate web with precision laser and special-purpose equipment
  • Scribing method for brittlement substrate web with precision laser and special-purpose equipment

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Embodiment Construction

[0017] See Fig. 5 and Fig. 6, the special equipment for precision laser scribing micro-parts, which includes an X-axis-Y-axis moving table and at least one pair of laser heads 3,8. The X-axis 4 and Y-axis 5 of the mobile worktable are arranged in the vertical plane; the Y-axis 5 of the mobile worktable is embedded in the slide rail 7 of the X-axis 4 and connected with the X-axis 4 with threads, and the chuck for clamping the base material 2 and the Y-axis 5 are threadedly connected, and the chuck frame of the chuck 2 clamping the base material is arranged in a vertical plane. The processing process of the present invention is described below in conjunction with accompanying drawing: base material 1 is installed in the mouth frame of chuck 2, and base material 1 is arranged vertically, and when marking the line horizontally on base material 1 surface, laser head 3,8 After alignment, the X-axis 4 drives the Y-axis 5 to move in the horizontal direction, and the laser heads 3 and ...

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Abstract

The invention relates to a method for precisely scribing brittle substrate by using laser, which can ensure the superposition accuracy of an upper and a lower scribed lines and can improve the scribing efficiency. The invention also provides special equipment for precisely scribing brittle substrate by using laser. The special equipment comprises an X-Y displacement workbench and laser heads, and is characterized in that the equipment has at least a pair of laser heads and two aligned laser heads are adopted for simultaneously scribing the same line on the front and the back sides of the substrate.

Description

(1) Technical field [0001] The invention relates to a precision laser scribing method for brittle substrates, and also relates to a special equipment for precision laser scribing brittle substrates. (2) Background technology [0002] In the manufacture of electronic micro components, such as the manufacturing process of miniature chip ceramic resistors or chip capacitors, it is finally necessary to split the neatly arranged resistors or capacitors on the ceramic substrate into individual resistor elements by means of splits, so that For subsequent processing, packaging and use, see Figure 1, Figure 2, and Figure 3. However, in the prior art, a molding method is used for larger-sized chip resistance elements, and a lot of lines are pre-pressed on the unfired, soft green ceramic sheet. After the ceramic sheet is fired, the lines are still maintained on the surface of the ceramic substrate. Can be used for final sharding. However, the disadvantage of this method is that the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/04B23K26/08B23K26/36
Inventor 熊焰明
Owner 江苏伊施德创新科技有限公司
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