Driving mechanism and cutting apparatus

A technology of driving mechanism and driving part, which is applied to fine working devices, mechanical equipment, shafts and bearings, etc. It can solve problems such as damage to the feed screw shaft 102, decline in chip quality, wafer vibration, etc., and achieve improved vibration absorption effect , improved stability, and fast rotation effects
CN101256979AInactive Publication Date: 2008-09-03DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2008-09-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a driving mechanism and a cutting device, wherein one end of the feed screw shaft of the driving mechanism is connected with a driving source, while the other end is supported rotatably, moving with a plurality of slide bodies connected with the feed screw screwed on the feed screw shaft, which prevents the vibration of the feed screw shaft in such a driving mechanism with the structure. A driving mechanism having a driving unit in which a drive source is connected to a feed screw shaft and a feed nut is in screw engagement with the feed screw shaft and connected to an active element through a sliding body, wherein the active element is moved by being driven by the driving unit. An inner ring of a bail bearing for supporting the feed screw shaft is fixed to the outer periphery of a free end portion of the feed screw shaft, and an outer ring elastic body which supports an outer ring of the ball bearing slidably in the axial direction of the feed screw shaft and which absorbs vibration of the feed screw shaft is disposed at the inner periphery of a tubular portion for containing the ball, bearing at a terminal support portion.
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Description

Technical field

[0001] The present invention relates to a driving mechanism having a function of moving various action units. Background technique

[0002] Wafers formed into ICs, LSIs, and other devices divided by planned dividing lines are divided into individual chips by cutting a cutting tool rotating at a high speed along the planned dividing line or irradiating a laser along the planned dividing line. For the division of such a wafer, for example, a cutting device described in Patent Document 1 is used.

[0003] The cutting device described in Patent Document 1, such as Figure 4 As shown, there is a chuck table 100 holding a wafer W. The chuck table 100 is driven by a driving mechanism 101 and can be Figure 4 Move in the direction of the arrow.

[0004] The structure of the drive mechanism 101 is that it is composed of the following components: a feed screw shaft 102 arranged in the moving direction of the chuck table 100; connected to one end of the feed screw shaft 102 ...

Claims

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