Driving mechanism and cutting apparatus

Abstract

The invention provides a driving mechanism and a cutting device, wherein one end of the feed screw shaft of the driving mechanism is connected with a driving source, while the other end is supported rotatably, moving with a plurality of slide bodies connected with the feed screw screwed on the feed screw shaft, which prevents the vibration of the feed screw shaft in such a driving mechanism with the structure. A driving mechanism having a driving unit in which a drive source is connected to a feed screw shaft and a feed nut is in screw engagement with the feed screw shaft and connected to an active element through a sliding body, wherein the active element is moved by being driven by the driving unit. An inner ring of a bail bearing for supporting the feed screw shaft is fixed to the outer periphery of a free end portion of the feed screw shaft, and an outer ring elastic body which supports an outer ring of the ball bearing slidably in the axial direction of the feed screw shaft and which absorbs vibration of the feed screw shaft is disposed at the inner periphery of a tubular portion for containing the ball, bearing at a terminal support portion.

Description

Technical field [0001] The present invention relates to a driving mechanism having a function of moving various action units. Background technique [0002] Wafers formed into ICs, LSIs, and other devices divided by planned dividing lines are divided into individual chips by cutting a cutting tool rotating at a high speed along the planned dividing line or irradiating a laser along the planned dividing line. For the division of such a wafer, for example, a cutting device described in Patent Document 1 is used. [0003] The cutting device described in Patent Document 1, such as Figure 4 As shown, there is a chuck table 100 holding a wafer W. The chuck table 100 is driven by a driving mechanism 101 and can be Figure 4 Move in the direction of the arrow. [0004] The structure of the drive mechanism 101 is that it is composed of the following components: a feed screw shaft 102 arranged in the moving direction of the chuck table 100; connected to one end of the feed screw shaft 102 ...

AI Technical Summary

Problems solved by technology

[0007] However, when in Figure 4 In the illustrated chuck table 100, a thin wafer having a thickness of, for example, 100 μm or less, or a wafer having an adhesive film for die bonding called die attach film , there is a problem that a lot of debris is generated on the peripheral edge of each chip formed by dicing, which reduces the quality of the chip

This is considered to be because the outer diameter of the outer ring 107a of the ball bearing 107 is several tens of μm smaller than the inner diameter of the cylindrical portion 104a in consideration of the thermal expansion caused by the rotation of the feed screw shaft 102. When the table 100 is processed and fed in the X-axis direction by the driving mechanism 101, the feed screw shaft 102 vibrates, and the sliding body 106 vibrates, and the vibration is transmitted to the chuck table 100, causing the wafer to vibrate.

[0008] In addition, if the feed speed of the drive mechanism 101 to the chuck table 100 is increased, the production efficiency of cutting can be improved, but if the rotation speed of the feed screw shaft 102 is increased for this reason, it will reach a critical speed. There is also the problem that the feed screw shaft 102 swings like a skipping rope and is damaged

[0009] Such a problem caused by the vibration of the feed screw shaft occurs not only in the driving mechanism for moving the chuck table 100 but also in other driving mechanisms having the same structure.

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