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Cardanol modifying phenolic resin composition and method for producing environmental protection type flame-proof paper-base copper-coating board

A technology of phenolic resin and phenolic resin solution, applied in circuit substrate materials, printed circuit components, etc., can solve the problems of unsuitable lead-free reflow soldering, performance cannot meet high-performance copper clad laminates, etc., to improve heat resistance, reduce cost effect

Active Publication Date: 2011-05-11
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Now, with the lightness, thinness and shortening of civilian electronic devices, the performance requirements of paper-based copper clad laminates are getting higher and higher. The performance of tung oil modified phenolic resin copper clad laminates currently used in production can no longer meet the requirements of high performance copper clad laminates. The production of paper-based copper-clad laminates cannot meet the requirements of industrial electrical power supplies, lighting facilities and other electronic products on circuit boards in terms of flame retardancy, peel strength, dielectric properties, water absorption, punching processability, and soldering resistance. Performance index requirements, not suitable for more demanding lead-free reflow soldering

Method used

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  • Cardanol modifying phenolic resin composition and method for producing environmental protection type flame-proof paper-base copper-coating board

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Experimental program
Comparison scheme
Effect test

Embodiment

[0052] The cardanol-modified phenolic resin in the resin composition of the present embodiment uses cardanol, phenol, and tung oil as raw materials to carry out an alkylation reaction under the action of an acid catalyst to form an intermediate. Then add formaldehyde and nitrogen-containing phenolic resin, and carry out polymerization reaction under the action of alkali catalyst. According to the weight ratio, the amount of cardanol accounts for 30-35% of the amount of phenol and tung oil. The acid catalyst is an acid catalyst such as hydrochloric acid, sulfuric acid, oxalic acid, phosphoric acid, sulfonic acid, formic acid, etc., and the consumption accounts for 0.44-0.54% of the amount of cardanol, phenol and tung oil. Alkali catalysts are ammonia, trimethylamine, triethylamine, triethanolamine, ethylenediamine, etc., and their dosage accounts for 4.5-5.5% of the amount of cardanol, phenol and tung oil

[0053] If the amount of cardanol used is small, the viscosity of the p...

specific Embodiment 1

[0054]Put into a 1000ml three-necked flask in turn: 200g phenol, 150g tung oil, 105g cardanol, 2g acid catalyst, react at 95-105°C for 1-2 hours, take samples to measure viscosity, the index is 850-950CPS / 25°C . After passing the test, put in 140 grams of formaldehyde, 22 grams of nitrogen-containing phenolic resin and 20.5 grams of alkali catalyst for reaction, and keep the reaction at 85-95 °C for 1-2 hours, and vacuumize and dehydrate when the time is up; when the temperature rises to 80 °C-90 °C, take a sample to test the gel time, control the gel time to 70-80 seconds / 160±2 °C, and then stop dehydration. The resulting resin is a dark red transparent liquid, which is the cardanol-modified phenolic resin solution; add an appropriate amount of methanol to dissolve to obtain a modified phenolic resin with a solid content of 51-55%, and then use it to impregnate 126g / m 2 The bleached wood pulp paper is dried to obtain a prepreg with a glue content of 50-51%. Combine 8 prepre...

specific Embodiment 2

[0055] Put 300 grams of phenol, 200 grams of tung oil, 175 grams of cardanol, and 3.64 grams of acid catalyst into a 1000 ml three-necked flask, react at 95-105°C for 1-2 hours, take a sample to measure the viscosity, and the index is 850-950CPS / 25°C . Drop in 132 grams of formaldehyde, 34 grams of nitrogen-containing phenolic resin and 38 grams of alkali catalyst after passing the test, operate according to the technique of specific embodiment 1, obtain sample 2. Test according to the same standard.

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Abstract

The invention relates to a cardanol modified phenol-formaldehyde resin and a method for producing an environmentally protective flame-retardant paper-based copper-covering plate by using the resin compound, and belongs to the technology field of the production method of the copper-covering plate. The cardanol modified phenol-formaldehyde resin is used for producing the copper-covering plate with cheap cardanol substituting for industrial phenyl hydroxide and tung oil partly. The cardanol is refined and abstracted from the raw oil extracted from fruits grown on a cashew which is a tropical plant. The modified resin compound contains flame retardants, such as nitride, phosphide, tetrabromobisphenol A and so on, and the flame retardants are free of such hazardous materials as polybrominated biphenyl, polybrominated diphenyl oxide and so on. Wood chip paper is dipped with the modified resin to form prepregs. Subsequently, a plurality of pieces of prepregs are stacked up, and are compressed into the copper-covering plate at a certain temperature and certain pressure. The copper-covering plate can reduce the product cost and ensure the performance, and is friendly to the environment.

Description

1. Technical field: [0001] The invention relates to a cardanol-modified phenolic resin and a method for producing an environment-friendly flame-retardant paper-based copper-clad laminate using the cardanol-modified phenolic resin composition, and belongs to the technical field of copper-clad laminate production methods. 2. Background of the invention: [0002] Copper Clad Laminate (Copper Clad Laminate, CCL for short) is widely used in the manufacture of printed circuit boards (PCB for short) used in various household appliances, electronic information products and industrial electronic products. As the substrate material of printed circuit boards, it plays the three major functions of carrying electronic components, forming conductive circuit patterns, and insulating between layers and lines. It is an important electronic basic material. [0003] In recent years, with the rapid development of the electronics industry, the competition among the copper clad laminate industry ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L61/34C08L63/00C08K5/136C08K3/32C08K5/49H05K1/03
Inventor 孙瑞珍刘明佩陈晓鹏刘玉斌王志英李雪顺
Owner SHANDONG JINBAO ELECTRONICS
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