The invention relates to a
polyimide film and a production process thereof. The
polyimide film is mainly formed by the
polymerization of material A 4,4'-bis(4-aminophenoxy)diphenylether and material B
biphenyl tetracarboxylic acid dianhydride, wherein the ratio of the number of
imide groups to the molecular weight of chain links is 2 / 678. The production process comprises the following steps: weighing the material A and the material b according to a weight ratio of 1.3:(0.99-1.0), and using N,N'-
dimethyl acetamide as a
solvent; throwing the material A into the
solvent, stirring until the material A is dissolved, throwing the material B into the
solvent in multiple times at a time interval of 20-50 minutes, and stirring, wherein the temperature is limited to 20-70 DEG C, and the weight of the solvent is 3-9 times of the total weight of the material A and the material B; and stopping throwing the material B when the resin
viscosity reaches the reaction end point (4.0-7.0*10<5> centipoises) at 30 DEG C, continuing to stir for 4-6 hours to obtain a
polyamic acid resin solution,
casting into a film, and carrying out imidization; and regulating the
viscosity when the material B remains 0.3-0.5
kilogram, wherein 0.03-0.1
kilogram of the material B is thrown each time, and the throwing amount is gradually reduced. The
imide group content of the film is greatly reduced, and the alkali resistance and the
moisture resistance of the film are greatly improved.