Halogen-free low-dielectric-loss epoxy resin composition and prepreg and laminated board prepared by using halogen-free low-dielectric-loss epoxy resin composition

A technology of epoxy resin and prepreg, which is applied in the direction of synthetic resin layered products, lamination, lamination devices, etc., can solve the problem of high frequency of operation signals, increase of polar groups in molecular structure, material dielectric rate and High water absorption and other problems, to achieve the effect of high performance, low dielectric constant and dielectric loss, low expansion coefficient

Inactive Publication Date: 2015-07-08
GUANGDONG GOWORLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] It can be seen that when an amine curing agent or a phenolic resin curing agent is used, during the curing process, the ring-opening reaction of the epoxy group generates secondary alcoholic hydroxyl groups, and the generation of secondary alcoholic hydroxyl groups will increase the polar groups of the molecular structure, thereby The dielectric rate and water absorption rate of the material are both high, which will result in poor dielectric properties of the plate and cannot meet the requirements of high-frequency operation signals.

Method used

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  • Halogen-free low-dielectric-loss epoxy resin composition and prepreg and laminated board prepared by using halogen-free low-dielectric-loss epoxy resin composition
  • Halogen-free low-dielectric-loss epoxy resin composition and prepreg and laminated board prepared by using halogen-free low-dielectric-loss epoxy resin composition
  • Halogen-free low-dielectric-loss epoxy resin composition and prepreg and laminated board prepared by using halogen-free low-dielectric-loss epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] First, weigh 15g of SMA resin (brand name is SMA-1000 ((n / m=8 / 1))), 193g of epoxy resin (including 30g of dicyclopentadiene epoxy resin, 60g of phosphorus-containing phenolic epoxy resin, isocyanate Type epoxy resin 100g, four-functional epoxy resin 3g), curing agent A 90g (of which dicyandiamide 0.5g, bisphenol A type phenolic resin 20g, phosphorus-containing phenolic resin 69.5g), curing agent B (that is, active esters curing agent) 70g, filler 100g (wherein aluminum hydroxide 70g, silicon dioxide 30g), curing accelerator 0.31g (both are 2-methylimidazole), coupling agent 1g (both are silane coupling agent, its brand is Z-6020), solvent 100g (wherein propylene glycol methyl ether 90g, butanone 10g).

[0038] The structural formula of above-mentioned active ester curing agent is as follows:

[0039]

[0040] where R 1 is an aliphatic group, R 2is an aromatic group. The trade mark of the active ester curing agent used in this embodiment is HPC-8000.

[0041] The...

Embodiment 2

[0047] First, weigh 15g of SMA resin (brand name is SMA-3000 (n / m=10 / 3)), 193g of epoxy resin (including 30g of dicyclopentadiene epoxy resin, 60g of bisphenol A type epoxy resin, bisphenol F type epoxy resin 100g, ortho-methyl phenolic type epoxy resin 3g), curing agent A 87.5g (wherein diaminodiphenylmethane 0.5g, bisphenol A type phenolic resin 23g, p-xylidine 64g), Curing agent B (i.e. active ester curing agent) 60g, filler 92g (of which kaolin 65g, silicon dioxide 27g), curing accelerator 0.38g (both 2-methylimidazole), coupling agent 0.92g (both silane Coupling agent, its trade mark is Z-6020), solvent 95g (wherein propylene glycol methyl ether 90g, butanone 5g).

[0048] The structural formula of above-mentioned active ester curing agent is as follows:

[0049]

[0050] where R 1 is an aliphatic group, R 2 is an aromatic group. The trade mark of the active ester curing agent used in this embodiment is HPC-8000.

[0051] Then, prepare the halogen-free low dielect...

Embodiment 3

[0057] First, weigh 15g of SMA resin (brand name is EF60 (12 / 5)), 193g of epoxy resin (33g of biphenyl type epoxy resin, 60g of bisphenol A novolac type epoxy resin, 100g of isocyanate type epoxy resin), solidify Agent A 86.5g (including 0.5g of diaminodiphenylsulfone, 26g of diaminodiphenylmethane, 60g of phosphorus-containing phenolic resin), 50g of curing agent B (ie active ester curing agent), 84g of filler (including 61g of mica powder , silicon dioxide 23g), flame retardant 3g (both 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphinephenanthrene-10-oxide), Curing accelerator 0.83g (both are 2-ethyl-4-methylimidazole), coupling agent 0.84g (both are silane coupling agent, its trade mark is Z-6020), solvent 95g (wherein propylene glycol methyl ether 90g, N,N-dimethylformamide 5g).

[0058] The structural formula of above-mentioned active ester curing agent is as follows:

[0059]

[0060] where R 1 is an aliphatic group, R 2 is an aliphatic group. The trade ma...

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PUM

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Abstract

The invention provides a halogen-free low-dielectric-loss epoxy resin composition, which comprises the following components in parts by weight: 5-20 parts of a SMA resin, 150-200 parts of an epoxy resin, 60-90 parts of a curing agent A, 40-70 parts of a curing agent B, 70-100 parts of packing, 0-13 parts of a flame retardant, 0.3-1 part of a curing accelerator, 0.7-1 part of a coupling agent, and 70-100 parts of a solvent, wherein the curing agent A is one or more of diamino sulfobenzide, diamino diphenylmethane, diamino diphenyl ether, amino paraxylene, dicyandiamide, phenolic novolac resin, bisphenol-A phenolic resin, and phosphorus-containing phenolic resin; and the curing agent B is an active ester curing agent. The invention also provides a prepreg and a laminated board prepared by using the composition. The epoxy resin composition and prepreg and laminated board disclosed by the invention can achieve a halogen-free flame retardant effect, and have low dielectric constants and dielectric losses.

Description

technical field [0001] The present invention relates to an epoxy resin composition, in particular to a halogen-free low dielectric loss epoxy resin composition, and prepregs and laminates made from the halogen-free low dielectric loss epoxy resin composition . Background technique [0002] In recent years, with the rapid development of computers, communication equipment and communication technology, the reliability of signal transmission has become the most concerned focus of people, among which information distortion control is the key to technology, and the dielectric properties of circuit substrate materials are increasingly subject to design attention. In order to transmit and process a large amount of information at high speed, the operating signal tends to be high-frequency, so higher requirements are placed on the dielectric properties of circuit substrate materials, as well as the fineness of circuit board processing and circuit accuracy. [0003] Traditional print...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L35/06C08G59/62C08G59/56C08G59/42C08K13/02C08K3/22C08K3/36C08K3/34C08K5/5313B32B15/092B32B15/20B32B27/04B32B27/38B32B37/06B32B37/10
Inventor 王岳群陈晓东郭瑞珂
Owner GUANGDONG GOWORLD
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