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Polyimide adhesive film with excellent comprehensive performance as well as preparation method and application thereof

A technology of polyimide film and comprehensive performance, applied in the field of polyimide, can solve the problems of low dielectric loss, low dielectric constant, etc. The effect of electrical loss

Active Publication Date: 2021-08-13
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above analysis, the present invention aims to provide a polyimide film with excellent comprehensive properties and its preparation method and application, in order to solve the problems of existing polyimide films with excellent heat resistance, good adhesion, etc. Performance, low dielectric constant and low dielectric loss at high frequency are difficult to achieve at the same time

Method used

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  • Polyimide adhesive film with excellent comprehensive performance as well as preparation method and application thereof
  • Polyimide adhesive film with excellent comprehensive performance as well as preparation method and application thereof
  • Polyimide adhesive film with excellent comprehensive performance as well as preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0052] In a three-necked flask equipped with a mechanical stirrer, a water separator, a nitrogen conduit, and a thermometer, add 38.54 grams (0.09 moles) of 1,4-bis(2-trifluoromethyl-4-aminophenoxy)benzene (6FAPB) , 8.00 grams (0.01 moles) of bis(3-aminopropyl) polydimethylsiloxane (PDMS) and 200 grams of N,N-dimethylacetamide (DMAc), stirred at room temperature under nitrogen protection until completely dissolved A homogeneous solution was obtained. Cool the above reaction system to 5°C, add 21.81 g (0.1 mole) of 1,2,4,5-pyromellitic anhydride (PMDA) and 187 g of DMAc, stir for 3 hours until completely dissolved, and continue stirring at room temperature After reacting for 14 hours, a polyamic acid solution with a solid content of 15 wt.% was obtained. After the obtained polyamic acid solution is filtered and vacuum defoamed, it is coated on a polytetrafluoroethylene board with a smooth surface, and most of the solvent is removed by heating at 60°C / 1.5 hours, and then peeled...

Embodiment 2

[0054] In a three-necked flask equipped with a mechanical stirrer, a water separator, a nitrogen conduit, and a thermometer, add 50.81 grams (0.098 moles) of 2,2-bis[4-(4-aminophenoxybenzene)]hexafluoropropane (HFBAPP) , 0.49 g (0.002 mol) of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (SiDA) and N,N-dimethylacetamide (DMAc ) 249 grams, stirred at room temperature under nitrogen protection until completely dissolved to obtain a homogeneous solution. Cool the above reaction system to 0°C, add 21.81 g (0.1 mole) of 1,2,4,5-pyromellitic anhydride (PMDA) and 200 g of DMAc, stir for 2 hours until completely dissolved, then continue stirring at room temperature After reacting for 11 hours, a polyamic acid solution with a solid content of 14 wt.% was obtained. After the obtained polyamic acid solution is filtered and vacuum defoamed, it is coated on a glass plate with a smooth surface, and most of the solvent is removed by heating at 80°C / 1 hour. Hold, and obtain a polyimi...

Embodiment 3

[0056] In a three-necked flask equipped with a mechanical stirrer, a water separator, a nitrogen conduit, and a thermometer, add 49.25 grams (0.095 moles) of 2,2-bis[4-(4-aminophenoxybenzene)]hexafluoropropane (HFBAPP) , 1.24 g (0.005 mol) of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (SiDA) and N,N-dimethylacetamide (DMAc ) 250 grams, stirred at room temperature under nitrogen protection until completely dissolved to obtain a homogeneous solution. Cool the above reaction system to 5°C, add 21.81 g (0.1 mole) of 1,2,4,5-pyromellitic anhydride (PMDA) and 129 g of DMAc, stir for 2 hours until completely dissolved, then continue stirring at room temperature After reacting for 10 hours, a polyamic acid solution with a solid content of 16 wt.% was obtained. After the obtained polyamic acid solution is filtered and vacuum defoamed, it is coated on a glass plate with a smooth surface, and most of the solvent is removed by heating at 70°C / 1.5 hours. Hold, and obtain a poly...

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Abstract

The invention relates to a polyimide adhesive film with excellent comprehensive performance as well as a preparation method and application thereof, belongs to the technical field of polyimide, and solves the problem that an existing polyimide adhesive film can hardly have excellent heat resistance, good adhesive property, low dielectric constant at high frequency and low dielectric loss. The polyimide adhesive film is mainly prepared from aromatic dianhydride, aromatic diamine containing a diphenyl ether structure and diamine containing a siloxane structure. The polyimide adhesive film has excellent heat resistance, high-frequency low dielectric property and good adhesive property. The glass-transition temperature is higher than 330 DEG C, the dielectric constant (Dk) at 10 GHz is smaller than 3, the dielectric loss (Df) value is 0.003-0.006, and the peel strength after the polyimide adhesive film is in hot-pressing adhesive connection with a copper foil is larger than 10 N / cm. The application requirements of flexible printed circuit board manufacturing and interlayer bonding and insulation in multi-layer circuit board lamination wiring processing can be met. The polyimide adhesive film provided by the invention can be widely applied to the fields of high-frequency flexible printed circuit boards, high-frequency film antennas and the like.

Description

technical field [0001] The invention relates to the technical field of polyimide, in particular to a polyimide adhesive film with excellent comprehensive properties and its preparation method and application, more specifically to a polyimide film with excellent heat resistance, high-frequency dielectric properties and good Adhesive polyimide adhesive film and its preparation method and application. Background technique [0002] Polyimide material has been widely used as an indispensable high-performance insulating material in the manufacture of flexible printed circuit boards in the field of microelectronics due to its excellent heat resistance and insulating properties. In recent years, microelectronic products tend to be more miniaturized, thinner, flexible, integrated and multifunctional, and more and more electronic devices are manufactured by high-density multilayer wiring based on flexible printed circuit boards. With the development of the fifth-generation mobile com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C09J179/08C09J7/10
CPCC08G73/1071C08G73/106C08G73/1039C08G73/1007C09J179/08C09J7/10C09J2479/08C09J2203/326
Inventor 范琳周永标刘仪莫松翟磊何民辉
Owner INST OF CHEM CHINESE ACAD OF SCI
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