Laser machining apparatus
A technology for laser processing and processed parts, which is applied in metal processing, photoengraving process exposure devices, laser welding equipment, etc., and can solve the problems of reduced processing accuracy, failure to consider imaging magnification, and inability to obtain pattern dimensional accuracy.
Inactive Publication Date: 2008-09-17
HITACHI SEIKO LTD
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Problems solved by technology
That is, if the processing is repeated using a large light output, the focal length of the projection lens will gradually change. And changes, the processing accuracy is reduced
[0014] However, since the above-mentioned Patent Documents 1 to 3 do not take into account the changes in imaging magnification due to changes in the position and contraction of the wiring pattern formed on the workpiece, or the thermal influence of the projection lens, in the case of application to the manufacture of package substrates, Under this condition, the required pattern size accuracy cannot be obtained
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[0032] Hereinafter, the present invention will be described.
[0033] figure 1 It is a structural diagram of the laser processing apparatus of this invention.
[0034]The laser beam 301 emitted from the XeCl excimer laser oscillator (oscillation wavelength: 308nm), which is not shown in the figure, is attenuated by the attenuator 302 to a desired light intensity, and is turned into a parallel beam by the collimator 303, and then enters the beam shaper 304 in. The beam shaper 304 changes the aspect ratio of the incident laser beam 301 and emits it as a laser beam 307 having a substantially uniform spatial intensity distribution (about ±3%). Furthermore, the size of the laser beam 307 in this embodiment is 5 mm×130 mm (X direction×Y direction). The laser beam 307 deflects the optical path by the mirror 305 and is incident on the mask 330 .
[0035] The mask 330 is positioned and fixed on a mask stage (not shown), and the mask stage has a movement mechanism for the X-axis, Y...
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Abstract
A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion / contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion / contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion / contraction ratio Ex. The moving speed of a mask and / or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion / contraction ratio Ey.
Description
technical field [0001] The present invention relates to a laser processing apparatus for processing a surface of a workpiece by irradiating a laser beam transmitted through a mask pattern onto the workpiece. Background technique [0002] Along with the high performance and miniaturization of electronic devices such as personal computers, flat televisions, and mobile phones, miniaturization and high density of wiring patterns in printed wiring boards constituting these devices are progressing. Especially, for printed wiring boards (hereinafter referred to as "packaging substrates") used for mounting large-scale semiconductor chips, this tendency is more remarkable. In recent years, the minimum line width of wiring patterns has been miniaturized to 10-20 microns (μm) degree. With regard to package substrates, it is considered that further miniaturization and higher density of wiring patterns are required in response to the trend of higher density and higher speed of semicondu...
Claims
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IPC IPC(8): G03F7/20H01L21/68B23K26/00B23K26/02
CPCB23K26/032B23K26/03B23K2201/40B23K26/0861B23K26/04B23K2201/42B23K26/043B23K26/0656B23K26/0738B23K26/041B23K26/042B23K26/066B23K2101/40B23K2101/42
Inventor 丸山重信青山博志志贺正幸大前吾一
Owner HITACHI SEIKO LTD