Capacitor micro microphone chip

Abstract

The invention discloses a microphone chip of a capacitor micro-microphone, the capacitor micro-microphone is obtained by orderly defining and forming a disengaging layer, a first electrode layer, a diaphragm layer and a sacrifice layer on a substrate by a semiconductor manufacturing process and a micro-electromechanics technology, then continuing defining a second electrode layer and a strengthening layer, etching and caverning the sacrifice layer through using sound hole images formed correspondingly to the second electrode layer and the strengthening layer to form air gaps, forming the capacitor micro-microphone connected with a substrate, and finally etching and removing the disengaging layer by a disengaging technology so that the capacitor micro-microphone is disengaged from the substrate. Because the method adopts the semiconductor manufacturing process and the micro-electromechanics technology, the capacitor micro-microphone is manufactured without a cutting process, the volume of the capacitor micro-microphone can be accurately reduced, the good rate of the manufacturing process is increased, and the substrate can be reclaimed and reused so as to reduce material cost.

Description

technical field [0001] The invention relates to a chip, in particular to a microphone chip packaged into a miniature microphone. Background technique [0002] Generally, miniature microphones can be divided into three types: piezoelectric, piezoresistive, and capacitive. Among them, the capacitive miniature microphone has the advantages of high sensitivity, low noise, low distortion, and low power consumption. , And become the mainstream of the current development of miniature microphones. [0003] However, the microphone chip packaged into a capacitive miniature microphone can be simply divided into a single-chip type that consists of a single substrate through multiple semiconductor manufacturing processes, such as lithography, etching, evaporation (sputtering) plating..., and then cutting (sawing). , and the two-chip type that consists of two separately formed chips and then bonded into one. [0004] No matter the microphone chip packaged in a single-chip or a two-chip ...

AI Technical Summary

Problems solved by technology

[0004] No matter the microphone chip packaged in the single-chip or double-chip condenser microphone, the common disadvantage is that bulk etching must be carried out in the manufacturing process to form the necessary "chip" for the condenser microphone. diaphragm (diaphragm)” and “air gap (air gap)” and other structures; and when the bulk etching process is required, the more parts to be etched, the longer the etching time required, and the more difficult the process is to control , the quality of the finished product will vary greatly, and the process yield cannot be improved; in addition, when the wafer is cut, the structure of the formed microphone chip will be damaged, resulting in a decrease in the overall process yield

Images