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Anisotropic conductive film and adhesion method thereof

An anisotropic, conductive film technology, applied in the field of anisotropic conductive film with high connection reliability and its adhesion, can solve problems such as connection reliability and height reduction

Inactive Publication Date: 2008-09-24
TORAY SAEHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although it helps to relieve stress during cooling, the elastic modulus of the thermoplastic resin is highly reduced at high temperature to cause a problem of connection reliability, so it is considered not a fundamental solution

Method used

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  • Anisotropic conductive film and adhesion method thereof
  • Anisotropic conductive film and adhesion method thereof
  • Anisotropic conductive film and adhesion method thereof

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Embodiment approach

[0052] Hereinafter, the present invention will be described in more detail with reference to the embodiments of the present invention. In the following descriptions, the term "parts by weight" refers to parts by weight, expressing the weight of solids. It should be noted that the invention is not limited by this definition.

[0053] First, a binder resin solution was produced by mixing 100 parts by weight of cresol novolac epoxy resin (YDCN 8P, commercially available from Toto Kasei Co.), 50 parts by weight of phenol novolak resin (KPH2000, commercially available) in a methyl ethyl ketone solvent. Kolon Chemical Co.) and 0.02 parts by weight of 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN, commercially available from Shikoku Kasei Industrial Co.), and then the mixture was stirred for 3 hours.

[0054] Subsequently, this binder resin solution was mixed with 20 parts by weight of conductive particles which were maghemite ( γ-Fe 2 o 3 ), the coated surface of the particles ...

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Abstract

The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.

Description

technical field [0001] The present invention relates to anisotropic conductive film and its adhesion method, and more particularly, to the ability to avoid thermal damage of parts by cold curing utilizing high frequency in adhering ICs such as LED displays, and by means of particles utilizing magnetic fields An anisotropic conductive film and an adhesion method thereof are controlled to realize high connection reliability for connection electrodes of a fine pitch. Background technique [0002] In general, an anisotropic conductive film (ACF) is an adhesive film used to connect connecting electrodes for circuits with opposite functions. In the process of adhering the film, conductivity and adhesiveness are required in the film thickness direction. Insulation properties are also required in the direction of the surface, and complex functional elements are required for the method of adhering the film. [0003] For example, in the process of producing flat panel displays (FPD)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16
CPCH01B1/22H05K3/323H05K2201/083H05K2203/104C09J5/06C09J7/00C09J9/02C09J11/04
Inventor 沈昌勋文基祯全海尚
Owner TORAY SAEHAN