Element-mounting board and semiconductor module
A technology for substrates and components, applied in the field of component mounting substrates, can solve problems such as circuit component malfunction, long-term failure including signal lines, reflection noise, etc., and achieves reduction of occupied area, miniaturization of transmission characteristics and excellent transmission characteristics. Effect
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no. 1 example
[0053] figure 1 is a plan view of the structure of the element mounting substrate and the semiconductor module according to the first embodiment of the present invention. figure 2 (A) is along figure 1 A cross-sectional view of a component mounting substrate and a semiconductor module on the X-X line, figure 2 (B) is along figure 1 The cross-sectional view of the element mounting substrate and the semiconductor module along the line Y-Y in the middle.
[0054] The element mounting substrate 100 of the first embodiment includes a wiring layer 8 in which a plurality of conductive layers 2, 3, 5, 7 and insulating layers 1, 4, 6 are alternately laminated, and is provided on the conductive layer 2 and the conductive layer 3. The signal wirings 2a and 3a arranged parallel to each other, a pair of pad electrodes 5a and 5b provided on the conductive layer 5 on the upper side of the wiring layer 8, and one pair of pad electrodes 5a and 5b provided on the conductive layer 7 on the ...
no. 2 example
[0076] image 3 It is a plan view showing the structure of the element mounting substrate and the semiconductor module according to the second embodiment of the present invention. Figure 4 (A) is along image 3 A cross-sectional view of a component mounting substrate and a semiconductor module on the X-X line, Figure 4 (B) is along image 3 The cross-sectional view of the element mounting substrate and the semiconductor module along the line Y-Y in the middle.
[0077] In the semiconductor module 250 , a plurality of pad electrodes 7 c are provided on the conductive layer 7 on the lower surface side of the wiring layer 8 of the element mounting substrate 200 . The circuit element 11 of the present embodiment is a BGA type IC chip, and external input and output pads (not shown) are arranged side by side in a grid pattern on the lower surface of the flat package, and the pads and pad electrodes 7c are connected via solder balls 12. connect. exist image 3 , Figure 4 In...
no. 3 example
[0079] Figure 5 It is a plan view showing the structure of the element mounting substrate and the semiconductor module according to the third embodiment of the present invention. Image 6 (A) is along Figure 5 A cross-sectional view of a component mounting substrate and a semiconductor module on the X-X line, Image 6 (B) is along Figure 5 The cross-sectional view of the element mounting substrate and the semiconductor module along the line Y-Y in the middle.
[0080] In the semiconductor module 350 of the third embodiment, not only the circuit element 9 of the semiconductor module 150 of the first embodiment but also the circuit element 13 is mounted on the surface opposite to the surface on which the circuit element 9 is mounted. It should be noted that the component mounting substrate 300 of this embodiment is substantially the same as the component mounting substrate 100 of the first embodiment, therefore, the same elements are assigned the same symbols, and descript...
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