Method for processing polishing cloth surface texture flow passage

A processing method and polishing cloth technology, which are applied in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve the problems affecting the surface smoothness and surface hardening of the wafer, reduce scratches, improve the smoothness, and simplify the process. Effect

Inactive Publication Date: 2008-10-08
天津市海伦晶片技术开发有限公司
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AI Technical Summary

Problems solved by technology

The surface flow channel processed by this method will harden the surface due to etching, which will affect the smoothness of the wafer surface

Method used

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  • Method for processing polishing cloth surface texture flow passage

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Embodiment Construction

[0016] As shown in FIG. 1 , a method for processing a textured flow channel on the surface of a polishing cloth uses a hot pressing method to press a desired textured flow path on the surface of the polishing cloth.

[0017] The above-mentioned hot pressing method first arranges the polishing in the high-frequency electromagnetic field between the upper and lower electrodes, so that the internal molecules are polarized and move and rub against each other, so as to generate heat by themselves, and then the surface of the polishing cloth 1 is placed on the pressure roller with convex texture. 2. The reticulated flow channel formed under rolling.

[0018] In the above-mentioned hot pressing method, firstly, the temperature of the convex-textured pressing roller used is raised, and then under the condition of high temperature and high pressure, the convex-textured pressing roller rolls on the surface of the polishing cloth to form the surface textured flow channel 3 .

[0019] As ...

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Abstract

The invention relates to a method for processing the reticulate pattern flow passage of the surface of polishing cloth. In the pressuring sintering method, the polishing cloth is first arranged in a high-frequency electromagnetic field between an upper electrode and a low electrode so as to realize the self-generation of heat, and then the reticulate pattern flow passage is formed on the surface of the polishing surface under the rolling of a roller provided with high-temperature convex reticulate patterns. The surface of the polishing cloth is provided with reticulate pattern flow passages, which are reticulate pattern grooves with a depth ranging from 0.4 to 0.4mm. The reticulate pattern is a reticulate pattern which is shaped like continuous Chinese characters 'JING' 'with an area of 2mm multiplied by 2mm. The method for processing the reticulate pattern flow passage of the surface of polishing cloth has the advantages that: the method for processing the reticulate pattern flow passage of the surface of polishing cloth has simple process, and can allow for continuous production. The polishing cloth provided with reticulate pattern flow passage on the surface can avoid crumbs or hairiness residuals from being generated in the reticulate pattern flow passage on the surface of the polishing cloth due to milling or the surface of the polishing cloth from being hardened due to the laser etching so as to enhance the finish of the wafer surface, thus reducing the scratching caused by the friction between the polishing cloth and the wafer, and causing the waste liquor generated in the process of polishing to flow in time and hitting the target of replacing the fresh medicine.

Description

[0001] Field: [0002] The invention belongs to a processing method for a flow channel on the surface of a polishing cloth used for processing wafers. In particular, it relates to a method for processing a textured flow channel on the surface of a polishing cloth. Background technique: [0003] There are two main processing techniques for the surface flow channel of the current wafer polishing cloth: one is to use the milling method to process the flow channel; The smoothness of the wafer surface. The second is to use laser etching to polish the flow channel on the surface of the cloth. The surface channel processed by this method will harden the surface due to etching, thereby affecting the smoothness of the wafer surface. Invention content: [0004] The object of the present invention is to overcome the deficiencies in the above-mentioned prior art, and provide a method for processing the textured flow channel on the surface of the polishing cloth. The textured flow cha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
Inventor 田鸿义李新立
Owner 天津市海伦晶片技术开发有限公司
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