Camera module group and its assembled method and portable electronic device

Abstract

The invention discloses a camera module which comprises a lens module and an image sensing wafer, wherein, the lens module comprises a lens barrel, a microscope base and a lens group; the microscope base is provided with a first opening and a second opening; the image sensing wafer is fixedly arranged on the second opening of the microscope base and seals the second opening; the bottom surface of the image sensing wafer is provided with a plurality of welding spots which are electrically connected with the image sensing wafer; and the plurality of welding spots are used for connecting the image sensing wafer to an external circuit structurally and electrically. The camera module is small in volume and strong in disturbance resistance in the process of transmitting electrical signals. In addition, the invention also relates to an assembly method for the camera module.

Description

technical field [0001] The invention relates to a camera module, in particular to a small-sized camera module, an assembly method thereof, and a portable electronic device applied thereto. Background technique [0002] With the development of camera technology, camera modules are widely used in camera devices for various purposes. The combination of camera modules and various portable electronic devices such as mobile phones, video cameras, computers, etc. is favored by many consumers. . In the small portable electronic device itself, a thin, light and small digital camera will become an indispensable requirement, which will also put forward higher requirements for the assembly of the camera module. [0003] like figure 1 A conventional camera module shown includes a flexible circuit board 30, an image sensing chip 34, a lens holder 44, and a lens barrel 42, and other optical elements such as lenses, apertures, and infrared filters are accommodated in the lens barrel 42 ,...

AI Technical Summary

Problems solved by technology

[0004] However, if the image sensor chip adopts the above packaging structure, a flexible circuit board must be added as the substrate, which will inevitably increase the cost.

At the same time, the flexible circuit board as the substrate will increase the volume of the camera module, which will inevitably lead to a larger volume of the camera module.

Moreover, since the electrical signal passes through the flexible circuit board as the transmission medium, various interferences will be generated from the outside during the transmission process of the electrical signal, so the anti-interference ability is poor.

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