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Pattern forming method, pattern forming apparatus, and device manufacturing method

A pattern and control device technology, applied in the field of component manufacturing, can solve the problem of expensive dual stages

Active Publication Date: 2012-05-09
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the double stage is very expensive, a technology that can suppress the decrease in the throughput due to the alignment operation without using the double stage is desired

Method used

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  • Pattern forming method, pattern forming apparatus, and device manufacturing method
  • Pattern forming method, pattern forming apparatus, and device manufacturing method
  • Pattern forming method, pattern forming apparatus, and device manufacturing method

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Experimental program
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no. 1 Embodiment approach 》

[0041] Below, according to Figure 1 to Figure 11 The first embodiment of the present invention will be described.

[0042] figure 1 In , the configuration of the exposure apparatus 100 according to the first embodiment is schematically shown. The exposure apparatus 100 is a scanning type exposure apparatus of a step & scan method, that is, a so-called scanner.

[0043] The exposure apparatus 100 includes an illumination system ILS for irradiating exposure illumination light (hereinafter referred to as illumination light or exposure light) IL to an illumination area IAR on the reticle R, and a reticle stage RST for holding the reticle R. , a projection unit PU including a projection optical system for projecting illumination light IL emitted from a reticle R onto a wafer W, a wafer stage WST on which a wafer is loaded, and a measurement stage MST for performing exposure measurement. Table device 150, alignment system ALG1, ALG2 (for alignment system ALG2 please refer to i...

no. 2 Embodiment approach 》

[0137] Next, a second embodiment of the present invention will be described. In the second embodiment, the configuration and the like of the exposure apparatus are the same as those in the first embodiment described above, and only the detection order of the alignment marks on wafer stage WST is different. Hereinafter, in order to avoid redundant descriptions, the same parts as those in the first embodiment are given the same reference numerals, and their descriptions are omitted.

[0138] Figure 12 In (A), similarly to the first embodiment, it is displayed that the detection of the first group of alignment marks is in progress (similar to that of the first embodiment). Figure 7 (B) correspondence).

[0139] here Figure 12 In the state shown in (A) (here, wafer stage WST and alignment systems ALG1 and ALG2 are both in a stopped state), when the first set of alignment mark detection (the first detection operation) is completed, wafer stage WST and alignment The barebones...

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Abstract

During a movement of a wafer stage (WST) from a loading position for introducing a wafer (W) onto a wafer stage (WST) to an exposure start position where exposure to the wafer (W) is started, at least a part of an alignment system (ALG1, ALG2) is moved so that a plurality of marks on the wafer (W) are detected by using the alignment system (ALG1, ALG2). This reduces the time required for detecting a mark, which in turn improves the throughput of the entire exposure step.

Description

technical field [0001] The present invention relates to a pattern forming method, a pattern forming device, and a device manufacturing method, and more specifically, relates to a pattern forming method and a pattern forming device for forming a pattern on an object, and device manufacturing using the pattern forming method and the pattern forming device method. Background technique [0002] The photolithography process used to manufacture micro-components (electronic components) such as semiconductor components and liquid crystal display components uses a pattern formed on a photomask or reticle (hereinafter collectively referred to as "reticle") through a projection optical system , An exposure device that transfers to a substrate coated with photoresist, such as a photosensitive object such as a wafer or a glass plate (hereinafter collectively referred to as a "wafer"). [0003] Semiconductor elements and the like are formed by overlapping multiple layers of patterns on a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/027H01L21/68G03F9/00
CPCG03F9/7088G03F9/7046G03F9/7003H01L21/682G03F7/70425G03F7/70433G03F9/7073H01L21/67259H01L21/67276
Inventor 柴崎佑一
Owner NIKON CORP