Heat sink and method of making same

Abstract

The invention provides a thin and light radiator with good assembly operation performance using parts in mass production, capable of effectively and adequately using heat conduction area with low cost, comprising: a heat pipe (2) of which a working fluid is filled and which is extended by a predetermined length from a heat source in a heat radiation direction; and a radiation fin (3) having a mountain portion (3m) and a valley portion (3v) formed in a longitudinal direction of the heat pipe (2), the mountain portion and the valley portion form a continuous waveform. The radiation fin further has a step portion (4) for fitting and retaining the heat pipe (2).

Description

technical field [0001] The present invention relates to a heat sink which is thin and light and has high thermal transferability as a heat dissipation component of electronic equipment and a manufacturing method thereof. Background technique [0002] A radiator is a device that releases heat generated by a heat source to suppress the temperature rise of the heat source. Generally, a heat sink made of an aluminum plate or a copper plate is provided with a heat pipe filled with a working fluid. [0003] For example, Figure 11 The existing radiator 111a shown in (a) is provided with heat pipe joint grooves 113 respectively on a plurality of single (individual) heat sinks 112 formed by a U-shaped shape in transverse cross section, and on these heat pipe joint grooves 113 The heat pipe 114 is joined (for example, refer to Patent Document 1 (Patent No. 3413151) and Patent Document 2 (Patent No. 3413152)). [0004] Figure 11 The conventional heat sink 111b shown in (b) is a devi...

AI Technical Summary

Problems solved by technology

[0005] However, the existing heat sinks 111a, 111b are all composed of single fins, which has the problem of high assembly cost

[0006] In addition, in the conventional heat sinks 111a, 111b, if the thickness of the individual heat sinks 112, 115 is made relatively thin, there is also a problem of poor assembly workability.

[0007] Furthermore, the existing heat sinks 111a, 111b require a certain degree of thickness for the individual cooling fins 112, 115, but there is a problem of light weight.

[0008] As a common problem of the two heat sinks 111a and 111b, there are problems such as that it takes time to assemble each heat sink according to the number of heat sinks, and it is impossible to manage the progress of assembling the heat sink every time.

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