Integrated circuit block recovery method and system
An integrated circuit and recycling method technology, applied in the field of integrated circuit block recycling, can solve problems such as deformation of integrated circuit blocks, and achieve the effects of overcoming deformation, improving recovery rate, and avoiding waste.
Inactive Publication Date: 2010-06-30
州西理科技服务有限公司 +1
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Problems solved by technology
[0012] The purpose of the present invention is to provide a method for recovering integrated circuit blocks to solve the problem of severe deformation of integrated circuit blocks in the prior art
[0013] Another object of the present invention is to provide a recycling system for integrated circuit blocks to solve the problem of severe deformation of integrated circuit blocks in the prior art
Method used
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Embodiment Construction
[0036] The invention aims at the problem that the integrated circuit block will be seriously deformed after being disassembled in the prior art. During the recycling process of the integrated circuit block, the pressure vessel equipment is used to carry out hot pressing treatment on the integrated circuit block, so that the integrated circuit block after hot pressing The die is flatter, which improves the recycling rate of the integrated circuit die.
[0037] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0038] See Figure 4 , which is a flowchart of a method for recovering integrated circuit blocks according to an embodiment of the present invention. The integrated circuit block recycling method is used to recycle a plurality of integrated circuit blocks that are attached to the panel and the printed circuit board when the liquid crystal display is assembled and need to be recycled.
[0039]S401, providing a pressur...
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The invention provides a method for recovering integrated circuit blocks and a system thereof. The method for recovering integrated circuit blocks includes the following steps: first, pressure vessel equipment, at least a tray and a pressure plate are provided and the interior of the pressure vessel equipment can be evenly heated and injected with compressed air and the number of the pressure plates is equal to that of the trays; second, integrated circuit blocks are dismantled from a panel board and a printed circuit board; third, the integrated circuit blocks are placed on the tray and covered with the pressure plate and then put in the pressure vessel equipment to be treated with hot pressing according to the predetermined temperature, time and pressure so as to improve the flatness ofthe integrated circuit blocks each of which is corresponding to one tray and one pressure plate; finally, the integrated circuit blocks are taken out of the pressure vessel equipment and stored to beput into production when necessary. The method and the system of the invention can maintain the flatness of the integrated circuit blocks after the recovery, thus improving the recovery rate of the integrated circuit blocks and saving production resources.
Description
technical field [0001] The invention relates to a method for recycling integrated circuit blocks, in particular to a method for recycling integrated circuit blocks to keep the flatness of the integrated circuit blocks. Background technique [0002] With the rapid development of multimedia, many flat panel display (Flat Panel Display) technologies have been developed successively, such as liquid crystal display (Liquid Crystal Display, LCD), which has gradually become the mainstream of modern displays. [0003] In the process of making an LCD display, a printed circuit board (PWB) is assembled with the panel of the display. Typically, an integrated circuit (IC) bridge is used between the printed circuit board and the panel. Such as figure 1 As shown, it is a schematic diagram of the connection of an existing integrated circuit block, printed circuit board and display panel. The printed circuit board 110 is adjacent to the S side of the panel 100 , and a plurality of integr...
Claims
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IPC IPC(8): B09B3/00B09B5/00
CPCY02W30/82
Inventor 夏腊梅
Owner 州西理科技服务有限公司