Method for forming graph

A patterning and sacrificial body technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inapplicability in mass production, poor repeatability, and complex photoresist processing processes, and achieve reduced requirements and relaxation of restrictions. Effect

CN101312113BInactive Publication Date: 2010-06-16SEMICON MFG INT (SHANGHAI) CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2010-06-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a pattern forming method, which comprises steps of providing a lining, forming sacrificers on the lining, filling a destination layer between the sacrificers to form a destination matter, defining masks on the sacrificer and the destination matter, removing the destination matter under a groove arranged among the masks by etching, and removing the masks and the sacrificers.The pattern forming method reduces requirements upon the photolithographic process in micro-pattern forming, releases limits to the thickness of photoresist, and can form much more micronic patternsbeyond the exposure limit of exposure machines.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a pattern forming method. Background technique

[0002] In the field of integrated circuit manufacturing, the production of semiconductor chips is usually divided into multiple layers, and the production of each layer needs to use photolithography technology for graphic definition to transfer the graphics from the photolithographic mask containing circuit design information to the wafer Above, a specific structure is formed, for example, a gate, a source / drain, a contact hole or a metal wiring of a device are formed.

[0003] With the rapid development of ultra-large-scale integrated circuits, the integration of chips is getting higher and higher, the feature size (CD, Critical Dimension) of components is getting smaller and smaller, and the graphic size that needs to be defined by lithography technology is also getting smaller and smaller. Small, more string...

Examples

Embodiment Construction

[0055] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0056]The processing method of the present invention can be widely used in various fields, and can utilize many suitable materials to make, and below is to illustrate by preferred embodiment, certainly the present invention is not limited to this specific embodiment, this field Common replacements known to those skilled in the art undoubtedly fall within the protection scope of the present invention.

[0057] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, which should not be used as a l...