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Electronic component-containing module and manufacturing method thereof

A technology of electronic devices and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, printed circuit manufacturing, etc., can solve problems such as difficult to increase mounting density, and achieve the effect of suppressing thickness

Inactive Publication Date: 2008-12-03
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] According to the above-mentioned flip-chip mounting, the range where IC chips can be mounted is the surface of the printed wiring board, and the mounting density is restricted by the size of the substrate, so it is difficult to further increase the mounting density dramatically.

Method used

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  • Electronic component-containing module and manufacturing method thereof
  • Electronic component-containing module and manufacturing method thereof
  • Electronic component-containing module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0149] figure 1 It is a sectional view showing the module with built-in electronic components in Embodiment 1 of the present invention. Such as figure 1 As shown, the electronic-device built-in module 101 in Embodiment 1 has a structure in which the first electronic device 102 and the second electronic device 103 are embedded in the electrically insulating substrate 104, and a part of the first electronic device 102 is formed from the electrically insulating substrate. The surface of the substrate 104 protrudes, and the entire second electronic device 103 is embedded in the electrically insulating substrate 104 .

[0150] The first electronic device 102 is mounted on the wiring pattern 105a. Among the electronic devices buried in the electrical insulating substrate 104, it is an electronic device whose thickness is higher than that of the second electronic device 103. The surface protrudes. On the other hand, the second electronic device 103 is an electronic device that i...

Embodiment approach 2

[0182] 5( a ) to ( e ) are cross-sectional views showing a method of manufacturing a module with built-in electronic devices in Embodiment 2 of the present invention. The manufacturing method of Embodiment 2 is another manufacturing method of the module with built-in electronic device in Embodiment 1. The difference from the method of manufacturing the module with built-in electronic device in Embodiment 1 is that the first electronic device 502 is Mounted on the wiring pattern 505a.

[0183] In addition, members corresponding to the electronic device built-in module of Embodiment 1 are made of the same kind of material that has been processed in the same way.

[0184] Hereinafter, a method of manufacturing the electronic device built-in module in this embodiment will be described with reference to FIGS. 5( a ) to ( e ).

[0185] First, as shown in FIG. 5(a), the second electronic device 503 is mounted on the wiring pattern 505a formed on the first release carrier 507a. The ...

Embodiment approach 3

[0201] Image 6 It is a cross-sectional view showing a method of manufacturing the module with built-in electronic devices in Embodiment 3 of the present invention.

[0202] Members corresponding to the electronic-device built-in module of Embodiment 1 are made of the same material processed in the same way.

[0203] Such as Image 6 As shown, the electronic-device built-in module 601 in Embodiment 3 is the same as Embodiments 1 and 2. Its structure is that a first electronic device 602 and a second electronic device 603 are embedded in an electrically insulating substrate 604, and the first electronic device A part of 602 protrudes from the surface of the electrically insulating substrate 604 , and the entire second electronic device 603 is embedded in the electrically insulating substrate 604 .

[0204] The difference between the third embodiment and the above-mentioned embodiments is that the first electronic device 602 is connected to the non-contact surface of the wirin...

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PUM

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Abstract

An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.

Description

technical field [0001] The present invention relates to an electronic device module in which passive devices such as resistors and capacitors, or active devices such as semiconductor elements are embedded in an electrically insulating substrate, and a method for manufacturing the same. Background technique [0002] In recent years, with the miniaturization and weight reduction of electronic equipment, the requirements for higher density of printed wiring boards and miniaturization of mounted components have become more and more stringent. In printed wiring boards, it is necessary to increase the density in a direction parallel to the surface of the wiring board due to the reduction of wiring rules. Furthermore, by laminating the wiring by a combination method, and forming internal via holes between arbitrary layers, it is also possible to achieve high density in the direction perpendicular to the surface of the wiring board. [0003] For high-density mounting, chip devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/31H01L23/14H01L21/50H01L21/56H05K3/46H05K3/30H05K1/18
CPCH05K1/186H05K2201/10378H05K2201/10454H05K2203/063H05K1/183H05K3/4614H05K1/187H05K2201/0394H01L2224/32225H05K3/20H01L2224/16227H01L2924/15311H01L2924/16251H01L2924/19105H01L2224/05548H01L2224/05573H01L2924/00014H01L2224/0554Y10T29/49137H01L2224/02379H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 冲本力也白石司石丸幸宏小岛俊之
Owner PANASONIC CORP