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Low-temperature brazing filler metal and manufacturing method thereof

A solder, low temperature technology, applied in the field of solder and its preparation, can solve the problems of high temperature oxidation of active elements, affecting solderability of solder and mechanical properties of joints, etc., and achieves the effect of low requirements, good interface bonding and flexible requirements.

Inactive Publication Date: 2008-12-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the preparation of brazing filler metal needs to go through the smelting process, there is melting and solidification of the brazing filler metal, and high-temperature oxidation of active elements occurs, thereby affecting the solderability of the brazing filler metal and the mechanical properties of the joint. A kind of low-temperature solder and preparation method thereof

Method used

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  • Low-temperature brazing filler metal and manufacturing method thereof

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specific Embodiment approach 1

[0019] Embodiment 1: In this embodiment, the low-temperature solder is composed of 7%-40% Sn, 2.5%-12% Ti, 0.01%-0.25% La, 0.1%-10% Ag and the balance Cu in mass percentage.

specific Embodiment approach 2

[0020] Specific embodiment two: In this embodiment, the low-temperature solder is composed of 7% to 40% Sn, 2.5% to 12% TiH by mass percentage 2 , 0.01% to 0.25% La, 0.1% to 10% Ag and the rest of Cu.

specific Embodiment approach 3

[0021] Embodiment 3: In this embodiment, the low-temperature solder is composed of 7%-40% Sn, 2.5%-12% Ti, 0.01%-0.25% La and the balance of Cu in this embodiment.

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Abstract

The invention provides low-temperature solders and a preparation method thereof, which relates to a low-temperature solder and the preparation method thereof. The low-temperature solder and the method solves the problem that the phenomenon of active element high temperature oxidation and the melting and solidifying of solders exist in the smelting process needed by the preparation of solders, thereby influencing the weldability and the joint mechanical property of solders. The solder of the invention consists of Ag, Cu, La, Sn and Ti or TiH2. The solder of the invention consists of La, Cu, Sn and Ti or TiH2. The preparation method of the solder of the invention is as follows: the active solder raw materials are added to a planetary ball mill to be ball milled. After adopting the solder brazing prepared by the method of the invention, the shear strength of brazed joints can reach 15.37MPa.

Description

technical field [0001] The invention relates to a solder and a preparation method thereof. Background technique [0002] At present, the preparation of most active solders needs to go through the smelting process. There are melting and solidification of solders, which will cause high-temperature oxidation of active elements, and most solders often obtain ideal joint performance by adding expensive Ag. . There are problems such as increased production cost, complicated control process, and unsatisfactory elimination effect. Contents of the invention [0003] The purpose of the present invention is to solve the problem that the preparation of brazing filler metal needs to go through the smelting process, there is melting and solidification of the brazing filler metal, and high-temperature oxidation of active elements occurs, thereby affecting the solderability of the brazing filler metal and the mechanical properties of the joint. A low-temperature solder and a preparation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24
Inventor 何鹏冯吉才谢凤春张九海曹健
Owner HARBIN INST OF TECH
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