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Radiating plate, interspace adjustable cooling clamper and mainboard

A technology of heat dissipation plate and spacing, applied in instruments, electrical digital data processing, digital data processing parts and other directions, can solve the problems of affecting the operation of electronic parts and high temperature, and achieve the effect of improving the heat dissipation effect and increasing the heat dissipation area.

Inactive Publication Date: 2008-12-10
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, although the fan 150 can reduce the temperature inside the host 100, the temperature near these heat sources is still relatively high due to the continuous operation and heat generation of the electronic components.
In this way, it will affect the operation of electronic parts

Method used

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  • Radiating plate, interspace adjustable cooling clamper and mainboard
  • Radiating plate, interspace adjustable cooling clamper and mainboard
  • Radiating plate, interspace adjustable cooling clamper and mainboard

Examples

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no. 1 example

[0050] FIG. 2 is a schematic diagram of the main board according to the first embodiment of the present invention, and FIG. 3 is a schematic diagram of the heat dissipation fixture with adjustable pitch in FIG. 2 . Please refer to FIG. 2 and FIG. 3 at the same time. The motherboard 2000 includes a substrate 2100 , a heat sink 2200 and a heat dissipation fixture 2300 with adjustable spacing.

[0051] The substrate 2100 has at least one socket 2110 and at least one first heat source. The first heat source is, for example, the south bridge chip 2120, which is responsible for controlling the peripheral devices connected to the peripheral component interface (PCI) bus. In addition, there is a north bridge chip (not shown) on the substrate 2100, and the north bridge chip is responsible for processing the signal transmission between the central processing unit (CPU), the main memory (Main Memory) and the peripheral component interface (Peripheral Component Interface, PCI) bus. The s...

no. 2 example

[0067] This embodiment is substantially the same as the first embodiment, and the same or similar component numbers represent the same or similar components. FIG. 6 is a schematic diagram of a heat sink placed on a motherboard according to a second embodiment of the present invention. Please refer to FIG. 2 and FIG. 6 at the same time. The cooling plate 200 is placed on the memory card slot (not shown) to contact the memory chip 2520 of the memory card 2500 on the motherboard 2000 to assist the memory card 2500 in cooling.

[0068] The cooling plate 200 includes a body 210 , a holding seat 220 and a heat pipe 230 . The body 210 has a surface facing the memory chip 2520 . The holding seat 220 is disposed on the surface and is suitable for contacting the memory chip 2520 . The body 210 and the holding seat 220 can be integrally formed, and the material of the body 210 and the holding seat 220 is a good conductor of heat, such as metal. One end of the heat pipe 230 is embedded...

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PUM

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Abstract

The present invention discloses a cooling plate, a gap-adjustable cooling clamp and a mainboard. The gap-adjustable cooling clamp is used to clamp at least one heat source of a tabular module. The gap-adjustable cooling clamp comprises a first cooling fin, a second cooling fin and at least one gap-adjusting part. A gap exists between the first cooling fin and the second cooling fin, and the heat source is suitably arranged in the gap and abuts against the first cooling fin and the second cooling fin. The gap-adjusting part, which is connected between the first cooling fin and the second cooling fin, is used to adjust the gap between the first cooling fin and the second cooling fin, so that the first cooling fin and the second cooling fin can clamp the heat source.

Description

technical field [0001] The invention relates to a main board, and in particular to a clamp capable of assisting the heat dissipation of the main board. Background technique [0002] Figure 1 is a schematic diagram of a known host. Please refer to FIG. 1 , the host 100 is equipped with a motherboard 110 , a power supply 120 , an optical drive 130 , a floppy disk drive 140 and a host fan 150 . The main board 110 is located on one side of the host 100, wherein the main board 110 has a central processing unit (CPU), and is inserted with many boards such as display cards, sound cards or memory cards, and other electronic components. The power supply 120 is located below the inside of the host 100, and the power supply 120 is adapted to be connected to an external power supply. The power supply 120 is electrically connected with the mainboard 110 by wires, so that the mainboard 110 has enough power to operate. [0003] Both the optical drive 130 and the floppy disk drive 140 ar...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 屈鸿均邱俊腾陈志恺高千涵
Owner ASUSTEK COMPUTER INC
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